BAP50-03 NXP Semiconductors, BAP50-03 Datasheet - Page 4

• Manufacturer Part Number: BAP50-03
• Description: General purpose PIN diode in a SOD323 small plastic SMD package
• Manufacturer: NXP Semiconductors

Specifications of BAP50-03

• Configuration: Single
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 500mW
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Package Type: SOD-323
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 40@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 5@10mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
7. Package outline
Fig 5.
BAP50-03_4
Product data sheet
Plastic surface-mounted package; 2 leads
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode
UNIT
mm
VERSION
OUTLINE
SOD323
Package outline SOD323
1.1
0.8
A
max
0.05
A
1
1
0.40
0.25
b
p
IEC
0.25
0.10
(1)
c
1.8
1.6
D
H
D
D
1.35
1.15
JEDEC
E
REFERENCES
0
H
2.7
2.3
Rev. 04 — 11 September 2009
D
0.45
0.15
2
L
A
p
0.25
0.15
JEITA
SC-76
Q
scale
b
X
v
p
1
M
0.2
v
A
A
2 mm
A
1
detail X
PROJECTION
EUROPEAN
General purpose PIN diode
E
L
BAP50-03
p
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
Q
c
03-12-17
06-03-16
SOD323
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