CBTV4020EE NXP Semiconductors, CBTV4020EE Datasheet - Page 10
CBTV4020EE
Manufacturer Part Number
CBTV4020EE
Description
Manufacturer
NXP Semiconductors
Datasheet
1.CBTV4020EE.pdf
(16 pages)
Specifications of CBTV4020EE
Operating Temperature (max)
85C
Operating Temperature (min)
0C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CBTV4020EE/G,118
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
13. Package outline
Fig 11. Package outline SOT761-1 (TFBGA72)
CBTV4020_3
Product data sheet
TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 6 x 6 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT761-1
max.
ball A1
index area
ball A1
index area
1.1
A
0.25
0.15
A 1
G
K
H
D
C
B
A
E
J
F
0.85
0.75
A 2
1
- - -
IEC
0.35
0.25
2
b
3
e
4
6.1
5.9
D
5
e 1
D
6
6.1
5.9
E
1/2
MO-195
7
JEDEC
e
8 9 10
0.5
e
b
0
REFERENCES
Rev. 03 — 4 April 2008
4.5
e 1
4.5
e 2
1/2
B
e
JEITA
scale
- - -
e
2.5
E
A
w
e 2
0.15
v
v
M
M
C
C
0.05
w
A
B
5 mm
0.08
y
A
A 2
0.1
y 1
y 1 C
A
1
PROJECTION
20-bit DDR SDRAM 2 : 1 MUX
detail X
EUROPEAN
X
CBTV4020
C
y
© NXP B.V. 2008. All rights reserved.
ISSUE DATE
02-04-10
SOT761-1
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