LPC1830FET256,551 NXP Semiconductors, LPC1830FET256,551 Datasheet - Page 5

• Manufacturer Part Number: LPC1830FET256,551
• Description: MCU 32BIT ARM CORTEX M3 256BGA
• Manufacturer: NXP Semiconductors
• Series: LPC18xxr

Specifications of LPC1830FET256,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 200K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Core: ARM Cortex M3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6683

NXP Semiconductors
5. Block diagram
LPC1850_30_20_10
Objective data sheet
Fig 1.
(1) Not available on all parts (see
BRIDGE 0
USART0
TIMER0
TIMER1
WWDT
UART1
SSP0
LPC1850/30/20/10 block diagram
SWD/TRACE PORT/JTAG
SCU
CORTEX-M3
TEST/DEBUG
INTERFACE
ARM
= connected to GPDMA
CONTROL
BRIDGE 1
MOTOR
PWM
I
I
2
2
C0
S0
GPDMA
BRIDGE 2
RI TIMER
USART2
USART3
TIMER2
TIMER3
Table
SSP1
QEI
AHB MULTILAYER MATRIX
All information provided in this document is subject to legal disclaimers.
2).
ETHERNET
IEEE 1588
10/100
MAC
Rev. 1.2 — 17 February 2011
10-bit ADC0
10-bit ADC1
BRIDGE 3
10-bit DAC
C_CAN
I
2
(1)
HIGH-SPEED PHY
C1
DEVICE/
USB0
SPEED
HOST/
HIGH-
OTG
(1)
BRIDGE
CCU1
CCU2
CGU
RGU
DEVICE
USB1
HOST/
(1)
POWER MODE CONTROL
BACKUP REGISTERS
RTC
CONFIGURATION
EVENT ROUTER
RTC POWER DOMAIN
LCD
ALARM TIMER
OTP MEMORY
32-bit ARM Cortex-M3 microcontroller
REGISTERS
12 MHz IRC
BRIDGE
(1)
LPC1850/30/20/10
RTC OSC
slaves
MMC
SD/
(1)
masters
64/96 kB LOCAL SRAM
LPC1850/30/20/10
16/32 kB AHB SRAM
40 kB LOCAL SRAM
16 kB AHB SRAM
32 kB ROM
slaves
© NXP B.V. 2011. All rights reserved.
HS GPIO
16 kB +
SPIFI
EMC
AES
SCT
002aaf218
(1)
5 of 87