X9250TS24Z-2.7T1 Intersil, X9250TS24Z-2.7T1 Datasheet - Page 19

• Manufacturer Part Number: X9250TS24Z-2.7T1
• Description: IC XDCP QUAD 256TP 100K 24-SOIC
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X9250TS24Z-2.7T1

• Taps: 256
• Resistance (ohms): 100K
• Number Of Circuits: 4
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Resistance In Ohms: 100K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thin Shrink Small Outline Package Family (TSSOP)
C
SEATING
PLANE
N LEADS
E
0.10 C
A
0.25
E1
B
c
A2
M
e
N
1
C A B
A1
SEE DETAIL “X”
TOP VIEW
b
DETAIL X
SIDE VIEW
D
END VIEW
19
L1
(N/2)+1
L
(N/2)
0.10
M
0° - 8°
0.05
PIN #1 I.D.
C A B
2X
N/2 LEAD TIPS
A
GAUGE
PLANE
0.20 C
0.25
B A
H
X9250
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
NOTES:
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
1. Dimension “D” does not include mold flash, protrusions or gate
2. Dimension “E1” does not include interlead flash or protrusions.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
A1
A2
E1
L1
D
A
b
E
e
L
c
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
6.50
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
7.80
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
9.70
6.40
4.40
0.65
0.60
1.00
+0.05/-0.06
+0.05/-0.06
Rev. E 12/02
Reference
August 29, 2006
±0.05
±0.05
±0.10
±0.10
±0.15
Basic
Basic
Max
FN8165.3