SC16C554BIBM NXP Semiconductors, SC16C554BIBM Datasheet - Page 50

• Manufacturer Part Number: SC16C554BIBM
• Manufacturer: NXP Semiconductors

Specifications of SC16C554BIBM

• Transmit Fifo: 16Byte
• Receive Fifo: 16Byte
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Package Type: LQFP
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
Fig 33. Package outline SOT778-3 (HVQFN48)
SC16C554B_554DB
Product data sheet
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
UNIT
mm
SOT778-3
OUTLINE
VERSION
terminal 1
index area
terminal 1
index area
max
A
1
(1)
E
L
0.05
0.00
h
A
12
1
1
e
0.25
0.15
13
b
48
IEC
- - -
0.2
c
D
6.1
5.9
(1)
D
e
D
1
h
JEDEC
3.95
3.65
D
1/2 e
All information provided in this document is subject to legal disclaimers.
- - -
h
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs
REFERENCES
E
6.1
5.9
b
(1)
37
Rev. 4 — 8 June 2010
3.95
3.65
0
24
E
h
JEITA
25
36
- - -
0.4
B
1/2 e
e
w
v
E
e
A
M
M
4.4
C
C
e
e
scale
1
2
2.5
A
B
4.4
e
2
A
0.5
0.3
L
SC16C554B/554DB
A
1
5 mm
0.1
y
v
1
C
PROJECTION
EUROPEAN
0.05
w
detail X
0.05
y
C
X
0.1
y
y
1
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
04-06-16
04-06-23
c
SOT778-3
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