TDA9950TT/C2,518 NXP Semiconductors, TDA9950TT/C2,518 Datasheet - Page 18

• Manufacturer Part Number: TDA9950TT/C2,518
• Manufacturer: NXP Semiconductors

Specifications of TDA9950TT/C2,518

• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Package Type: TSSOP
• Pin Count: 20
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
13. Package outline
Fig 10. Package outline SOT360-1 (TSSOP20)
TDA9950_2
Product data sheet
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT360-1
max.
1.1
A
0.15
0.05
A
1
20
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
D
6.6
6.4
Rev. 02 — 22 October 2009
0
(1)
11
10
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
CEC/I
3
w
X
v
TDA9950
0.1
A
© NXP B.V. 2009. All rights reserved.
2
y
M
C-bus translator
ISSUE DATE
A
99-12-27
03-02-19
Z
0.5
0.2
(1)
SOT360-1
8
0
o
o
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