BCP51T/R NXP Semiconductors, BCP51T/R Datasheet
BCP51T/R
Specifications of BCP51T/R
Related parts for BCP51T/R
BCP51T/R Summary of contents
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BC636; BCP51; BCX51 PNP medium power transistors Rev. 08 — 22 February 2008 1. Product profile 1.1 General description PNP medium power transistor series. Table 1. Type number [2] BC636 BCP51 BCX51 [1] Valid for all ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOT54 SOT54A SOT54 variant SOT223 SOT89 BC636_BCP51_BCX51_8 Product data sheet Pinning Description base collector emitter base collector emitter base collector emitter base collector emitter collector emitter collector base Rev. 08 — 22 February 2008 BC636; BCP51; BCX51 PNP medium power transistors Simplifi ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number [2] BC636 BCP51 BCX51 [1] Valid for all available selection groups. [2] Also available in SOT54A and SOT54 variant packages (see 4. Marking Table 5. Type number BC636 BC636-10 BCP51 BCP51-10 BCP51-16 BCX51 BCX51-10 BCX51-16 BC636_BCP51_BCX51_8 Product data sheet Ordering information ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 1.6 P tot (W) 1.2 0.8 0 FR4 PCB, standard footprint Fig 1. Power derating curve SOT54 (1) FR4 PCB, mounting pad for collector 6 cm (2) FR4 PCB, mounting pad for collector 1 cm (3) FR4 PCB, standard footprint Fig 3. Power derating curves SOT89 BC636_BCP51_BCX51_8 Product data sheet ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm ...
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... NXP Semiconductors th(j-a) duty cycle = (K/ 0.5 0.33 0.2 0.1 10 0.05 0.02 0. FR4 PCB, standard footprint Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values 3 10 duty cycle = Z th(j-a) (K/W) 1 0.75 0.5 0.33 0.2 ...
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... NXP Semiconductors duty cycle = th(j-a) (K/W) 1 0.75 2 0.5 10 0.33 0.2 0.1 0.05 10 0.02 0. FR4 PCB, standard footprint Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0 ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) (K/W) 1 0.75 0.5 0.33 0.2 10 0.1 0.05 0.02 0. FR4 PCB, mounting pad for collector 6 cm Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values 7. Characteristics Table unless otherwise specified. ...
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... NXP Semiconductors 300 ( 200 (2) 100 ( ( 150 C amb ( amb ( amb Fig 10. DC current gain as a function of collector current; typical values 1200 V BE (mV) 1000 (1) 800 (2) 600 (3) 400 200 ( amb ( amb ( 150 C amb Fig 12. Base-emitter voltage as a function of collector current; typical values BC636_BCP51_BCX51_8 Product data sheet ...
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... NXP Semiconductors 8. Package outline 4.2 3.6 4.8 4.4 5.2 14.5 5.0 12.7 Dimensions in mm Fig 14. Package outline SOT54 (SC-43A/TO-92) 4.2 3.6 2.5 max 4.8 4.4 5.2 14.5 5.0 12.7 Dimensions in mm Fig 16. Package outline SOT54 variant Fig 18. Package outline SOT89 (SC-62/TO-243) ...
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... NXP Semiconductors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [2] Type number Package BC636 SOT54 SOT54A SOT54 variant BCP51 SOT223 BCX51 SOT89 [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups. ...
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... NXP Semiconductors 10. Revision history Table 10. Revision history Document ID Release date BC636_BCP51_BCX51_8 20080222 • Modifications: BC636_BCP51_BCX51_7 20070629 BC636_BCP51_BCX51_6 20060329 BC636_638_640_5 20041011 BCP51_52_53_5 20030206 BCX51_52_53_4 20011010 BC636_BCP51_BCX51_8 Product data sheet Data sheet status Product data sheet Figure 11: amended Product data sheet Product data sheet Product specifi ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Packing information Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 11 Legal information ...