DSP56301PW100 Freescale Semiconductor, DSP56301PW100 Datasheet - Page 79

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DSP56301PW100

Manufacturer Part Number
DSP56301PW100
Description
IC DSP 24BIT FIXED-POINT 208LQFP
Manufacturer
Freescale Semiconductor
Series
DSP563xxr
Type
Fixed Pointr
Datasheet

Specifications of DSP56301PW100

Interface
Host Interface, SSI, SCI
Clock Rate
100MHz
Non-volatile Memory
ROM (9 kB)
On-chip Ram
24kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSP56301PW100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Packaging
This section provides information on the available packages for the DSP56301, including diagrams of the package
pinouts and tables showing how the signals discussed in Section 1 are allocated for each package. The DSP56301
is available in two package types:
Note: Both packages are available in lead-bearing and lead-free versions. Switching a design from a lead-bearing
Freescale Semiconductor
208-pin Thin Quad Flat Pack (TQFP)
252-pin Molded Array Process-Ball Grid Array (MAP-BGA)
package device to a lead-free package device may require a change in the board manufacturing process.
The lead-free package requires a higher solder flow temperature than the lead-bearing device. Refer to
Lead-Free BGA Solder Joint Assembly Evaluation (EB635) for manufacturing considerations when
incorporating lead-free package devices into a design.
DSP56301 Technical Data, Rev. 10
3
3-1

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