EP4CE40F29I7N Altera, EP4CE40F29I7N Datasheet - Page 27

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EP4CE40F29I7N

Manufacturer Part Number
EP4CE40F29I7N
Description
IC CYCLONE IV FPGA 40K 780FBGA
Manufacturer
Altera
Series
CYCLONE® IV Er

Specifications of EP4CE40F29I7N

Number Of Logic Elements/cells
39600
Number Of Labs/clbs
2475
Total Ram Bits
1134000
Number Of I /o
532
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
780-FBGA
Family Name
Cyclone IV
Number Of Logic Blocks/elements
39600
Logic Cells
39600
Ram Bits
1161216
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
780
Package Type
FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant

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Chapter 1: Cyclone IV Device Datasheet
Switching Characteristics
Periphery Performance
Table 1–31. RSDS Transmitter Timing Specifications for Cyclone IV Devices
© December 2010 Altera Corporation
f
(input clock
frequency)
HSCLK
Symbol
f
1
Modes
×10
×8
×7
×4
×2
×1
Table 1–30. JTAG Timing Parameters for Cyclone IV Devices
This section describes periphery performance, including high-speed I/O and external
memory interface.
I/O performance supports several system interfaces, such as the high-speed I/O
interface, external memory interface, and the PCI/PCI-X bus interface. I/Os using the
SSTL-18 Class I termination standard can achieve up to the stated DDR2 SDRAM
interfacing speeds. I/Os using general-purpose I/O standards such as 3.3-, 3.0-, 2.5-,
1.8-, or 1.5-LVTTL/LVCMOS are capable of a typical 200 MHz interfacing frequency
with a 10 pF load.
For more information about the supported maximum clock rate, device and pin
planning, IP implementation, and device termination, refer to
Performance Specifications
Actual achievable frequency depends on design- and system-specific factors. Perform
HSPICE/IBIS simulations based on your specific design and system setup to
determine the maximum achievable frequency in your system.
High-Speed I/O Specifications
Table 1–31
For definitions of high-speed timing specifications, refer to
t
Notes to
(1) For more information about JTAG waveforms, refer to
(2) The specification is shown for 3.3-, 3.0-, and 2.5-V LVTTL/LVCMOS operation of JTAG pins. For 1.8-V
(3) For EP4CGX22, EP4CGX30 (F324 and smaller package), EP4CGX110, and EP4CGX150 devices, the output time
Symbol
JSXZ
LVTTL/LVCMOS and 1.5-V LVCMOS, the output time specification is 16 ns.
specification for 3.3-, 3.0-, and 2.5-V LVTTL/LVCMOS operation of JTAG pins is 16 ns. For 1.8-V LVTTL/LVCMOS
and 1.5-V LVCMOS, the output time specification is 18 ns.
Min Typ Max Min Typ
10
10
10
10
10
10
Table
Update register valid output to high impedance
through
C6
1–30:
180
180
180
180
180
360
Table 1–36
10
10
10
10
10
10
of the External Memory Interfaces Handbook.
C7, I7
list the high-speed I/O timing for Cyclone IV devices.
Parameter
155.5
155.5
155.5
155.5
155.5
Max
311
Min
10
10
10
10
10
10
“JTAG Waveform”
C8, A7
(Note
Typ
1), (2),
155.5
155.5
155.5
155.5
155.5
Max
311
(Note 1)
in
(4)
Cyclone IV Device Handbook, Volume 3
“Glossary” on page
Min Typ
“Glossary” on page
10
10
10
10
10
10
(Part 1 of 2)—Preliminary
(Part 2 of 2)—Preliminary
Section III: System
C8L, I8L
Min
155.5
155.5
155.5
155.5
155.5
Max
311
1–38.
Max
25
Min Typ
10
10
10
10
10
10
1–38.
Unit
ns
1–27
C9L
132.5
132.5
132.5
132.5
132.5
Max
265
MHz
MHz
MHz
MHz
MHz
MHz
Unit

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