MPC8248VRMIBA Freescale Semiconductor, MPC8248VRMIBA Datasheet - Page 55

IC MPU POWERQUICC II 516-PBGA

MPC8248VRMIBA

Manufacturer Part Number
MPC8248VRMIBA
Description
IC MPU POWERQUICC II 516-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8248VRMIBA

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
266MHz
Voltage
1.5V
Mounting Type
Surface Mount
Package / Case
516-PBGA
For Use With
CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-

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9
Figure 13
Table 21
nomenclature of the 516 PBGA package.
Freescale Semiconductor
Package
Plated substrate via
provides package parameters.
shows the side profile of the PBGA package.
1 mm pitch
VR, ZQ
Code
In the VR package, sphere composition is lead-free (refer to
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Freescale
PowerQUICC II™ Pb-Free Packaging Information”
(MPC8250PBFREEPKG) available at www.freescale.com.
Transfer molding compound
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 2
NOTE: Temperature Reflow for the VR Package
Figure 13. Side View of the PBGA Package Remove
PBGA
Type
Table 21. Package Parameters
Figure 14
27 x 27
Outline
(mm)
attach
Die
provides the mechanical dimensions and bottom surface
DIE
Interconnects
Ball bond
Wire bonds
516
Pitch
(mm)
1
Table
Nominal Unmounted
Height (mm)
2). This
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
2.25
Package
55

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