MPC862PZQ100B Freescale Semiconductor, MPC862PZQ100B Datasheet - Page 13

• Manufacturer Part Number: MPC862PZQ100B
• Description: IC MPU POWERQUICC 100MHZ 357PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC862PZQ100B

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 100MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 100MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465/3.6V
• Operating Supply Voltage (min): 2/3.135V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

7.2
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
where:
R
affect the case-to-ambient thermal resistance, R
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
7.3
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two
resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The
junction-to-case covers the situation where a heat sink is used or where a substantial amount of heat is
dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal
performance when most of the heat is conducted to the printed circuit board. It has been observed that the
thermal performance of most plastic packages and especially PBGA packages is strongly dependent on the
board temperature; see
Freescale Semiconductor
θJC
is device related and cannot be influenced by the user. The user adjusts the thermal environment to
R
R
R
θJA
θJC
θCA
Estimation with Junction-to-Case Thermal Resistance
Estimation with Junction-to-Board Thermal Resistance
R
θJA
= junction-to-case thermal resistance (ºC/W)
= junction-to-ambient thermal resistance (ºC/W)
= case-to-ambient thermal resistance (ºC/W)
= R
MPC862/857T/857DSL PowerQUICC™ Family Hardware Specifications, Rev. 3
θJC
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
100
90
80
70
60
50
40
30
20
10
0
Figure
+ R
0
θCA
Board Temperture Rise Above Ambient Divided by Package
3.
20
θCA
. For instance, the user can change the air flow around
Power
40
60
Thermal Calculation and Measurement
80
13