MPC8245TVV300D Freescale Semiconductor, MPC8245TVV300D Datasheet - Page 13

• Manufacturer Part Number: MPC8245TVV300D
• Description: IC MPU 32BIT 300MHZ PPC 352-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8245TVV300D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 300MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 300 MHz
• Operating Supply Voltage: 1.8 V, 1.9 V, 2 V, 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

4.4
Table 6
“Thermal Management.”
4.5
After fabrication, functional parts are sorted by maximum processor core frequency as shown in
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.
Parts are sold by maximum processor core frequency. See
on ordering parts.
Freescale Semiconductor
Junction-to-ambient natural convection
(Single-layer board—1s)
Junction-to-ambient natural convection
(Four-layer board—2s2p)
Junction-to-ambient (@200 ft/min)
(Single-layer board—1s)
Junction-to-ambient (@200 ft/min)
(Four layer board—2s2p)
Junction-to-board
Junction-to-case
Junction-to-package top (natural convection)
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1) with the cold plate used for case temperature.
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
provides the package thermal characteristics for the MPC8245. For details, see
Thermal Characteristics
AC Electrical Characteristics
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Characteristic
Table 6. Thermal Characteristics
Section 9, “Ordering Information,”
Symbol
R
R
R
R
R
R
Ψ
θ
θ
θ
θ
θ
θ
JMA
JMA
JMA
JT
JC
JA
JB
Electrical and Thermal Characteristics
Value
16.1
12.0
11.6
9.0
4.8
1.8
1.0
Section 7.8,
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
for details
Table 7
Notes
1, 2
1, 3
1, 3
1, 3
4
5
6
13