MPC8255AZUMHBB Freescale Semiconductor, MPC8255AZUMHBB Datasheet - Page 12

• Manufacturer Part Number: MPC8255AZUMHBB
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8255AZUMHBB

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 266MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Electrical and Thermal Characteristics
2.2
Table 4
2.3
The average chip-junction temperature
where
For most applications P
T
12
J
is the following:
Notes:
Notes:
1. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent
excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as
outputs.
2. The leakage current is measured for nominal VDD, VCCSYN, and VDD.
3. MPC8265 and MPC8266 only.
Junction to ambient
Junction to board
Junction to case
T
T
θ
P
P
P
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1
1. Assumes a single layer board with no thermal vias
2. Natural convection
3. Assumes a four layer board
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
is measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
describes thermal characteristics.
A
D
INT
I/O
JA
J
Thermal Characteristics
Power Considerations
= T
= ambient temperature °C
= P
= package thermal resistance
= power dissipation on input and output pins (determined by user)
= I
A
INT
DD
+ (P
Characteristics
+ P
x V
D
(5)
I/O
x
(4)
DD
θ
I/O
JA
Watts (chip internal power)
Table 4. Thermal Characteristics for 480 TBGA Package
)
< 0.3 x P
INT
,
junction to ambient
,
. If P
T
J
,
in °C can be obtained from the following:
Symbol
I/O
θ
θ
θ
JA
JB
JC
is neglected
,
°C/W
,
Value
13
11
an approximate relationship between P
10
1.1
8
4
(1)
(3)
3
1
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor
Air Flow
NC
1 m/s
1 m/s
NC
—
—
(2)
(1)
D
and