MPC7410RX500LE Freescale Semiconductor, MPC7410RX500LE Datasheet - Page 46

• Manufacturer Part Number: MPC7410RX500LE
• Description: IC MPU 32BIT 500MHZ PPC 360-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC7410RX500LE

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 500MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

System Design Information
8.8.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where:
During operation the die-junction temperatures (T
The temperature of the air cooling the component greatly depends upon the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
to 40°C. The air temperature rise within a cabinet (T
the thermal interface material (θ
θ
Die-junction temperature: T
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (θ
shown in
Assuming an air velocity of 0.5 m/s, we have an effective R
resulting in a die-junction temperature of approximately 75°C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, The Bergquist Company, IERC, and Wakefield
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need airflow.
46
jc
= 0.03, and a power consumption (P
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
θ
θ
θ
P
a
jc
int
sa
d
r
j
Figure
is the die-junction temperature
is the air temperature rise within the computer cabinet
is the inlet cabinet ambient temperature
is the power dissipated by the device
is the junction-to-case thermal resistance
is the heat sink base-to-ambient thermal resistance
is the adhesive or interface material thermal resistance
T
T
30.
j
j
= T
= 30°C + 5°C + (0.03°C/W + 1.0°C/W + 7°C/W) × 5.0 W,
a
+ T
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
r
+ (θ
j
= 30°C + 5°C + (0.03°C/W + 1.0°C/W + θ
int
jc
) is typically about 1°C/W. Assuming a T
+ θ
int
d
+ θ
) of 5.0 W, the following expression for T
sa
) × P
j
d
) should be maintained less than the value specified in
r
) may be in the range of 5° to 10°C. The thermal resistance of
sa
888-246-9050
of 7°C/W, thus
sa
a
) × 5.0 W
of 30°C, a T
j
sa
is obtained:
) versus airflow velocity is
r
of 5°C, a CBGA package
Freescale Semiconductor
a
) may range from 30°
Table
3.