MPC755BRX300LE Freescale Semiconductor, MPC755BRX300LE Datasheet - Page 47

• Manufacturer Part Number: MPC755BRX300LE
• Description: IC MPU 32BIT 300MHZ PPC 360-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC755BRX300LE

• Processor Type: MPC7xx PowerPC 32-Bit
• Speed: 300MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Freescale Semiconductor
The Bergquist Company
18930 West 78
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
1.5
0.5
2
1
0
Figure 27. Thermal Performance of Select Thermal Interface Materials
0
th
St.
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
10
20
Contact Pressure (psi)
30
40
800-347-4572
781-935-4850
800-248-2481
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
70
System Design Information
80
47