EE80960SA16512 Intel, EE80960SA16512 Datasheet - Page 31

• Manufacturer Part Number: EE80960SA16512
• Description: IC MPU I960SA 16MHZ 84-PLCC
• Manufacturer: Intel

Specifications of EE80960SA16512

• Processor Type: i960
• Features: SA suffix, 32-Bit, 512 Byte Cache
• Speed: 16MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 84-PLCC
• Family Name: i960
• Device Core Size: 32b
• Frequency (max): 16MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 68
• Package Type: PLCC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 863981

3.4
The 80960SA is specified for operation when case
temperature is within the range 0°C to +85°C (PLCC)
or 0°C to 100°C (QFP). Measure case temperature
at the top center of the package. Ambient temper-
ature can be calculated from:
T
T
T
3.5
Upon reset, register g0 contains die stepping infor-
mation. Table 15 shows the relationship between the
number in g0 and the current die stepping
A
J
C
= T
= T
= T
C
J
A
- P*
Package Thermal Specifications
Stepping Register Information
+ P*
+ P*
measured in the middle of the
top of the package)
(No Heatsink)
NOTES:
This table applies to 80960SA QFP soldered directly to board.
(No Heatsink)
NOTES:
This table applies to 80960SA PLCC soldered directly to board.
JA
Junction-to-Ambient (Case
Junction-to-Case
Junction-to-Ambient
Junction-to-Case
JC
JA
Parameter
JC
Parameter
]
Table 14. 80960SA PLCC Package Thermal Characteristics
Table 13. 80960SA QFP Package Thermal Characteristics
34
12
0
Thermal Resistance — °C/Watt
Thermal Resistance — °C/Watt
59
11
0
50
32
12
50
57
11
29.5
100
12
Airflow — ft./min (m/sec)
Airflow — ft./min (m/sec)
Compute P by multiplying the maximum voltage by
the typical current at maximum temperature. Values
for
13 for the QFP package and in Table 14 for the
PLCC package. I
typically 80 percent of specified I
The current numbering pattern in g0 may not be
consistent with past or future steppings of this
product.
100
54
11
200
28
12
JA
Table 15. Die Stepping Cross Reference
and
Register g0
01010101H
200
50
11
400
25
12
JC
for various airflows are given in Table
CC
400
600
44
11
23
12
at maximum temperature is
600
800
40
11
21
12
CC
Die Stepping
maximum (cold).
1000
20.5
800
38
11
12
C-1
80960SA
27