MC8640DVU1067NC Freescale Semiconductor, MC8640DVU1067NC Datasheet - Page 112

• Manufacturer Part Number: MC8640DVU1067NC
• Description: MPU DUAL E600 1023-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC8640DVU1067NC

• Processor Type: MPC86xx PowerPC 32-Bit
• Speed: 1.067GHz
• Voltage: 0.95V
• Mounting Type: Surface Mount
• Package / Case: 1023-FCCBGA
• Family Name: MC8xxx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 1.067GHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 0.95/1.05V
• Operating Supply Voltage (max): 1/1.1V
• Operating Supply Voltage (min): 0.9/1V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 1023
• Package Type: FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

Thermal
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
19.2.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where:
112
The Bergquist Company
18930 West 78
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
Corporate Center
PO Box 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
R
R
R
P
i
r
d
j
θJC
θint
θsa
is the die-junction temperature
is the inlet cabinet ambient temperature
is the air temperature rise within the computer cabinet
is the power dissipated by the device
is the heat sink base-to-ambient thermal resistance
is the junction-to-case thermal resistance
is the adhesive or interface material thermal resistance
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
T
j
= T
i
th
+ T
St.
r
+ (R
θJC
+ R
θint
+ R
θsa
) × P
d
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