ULN2075B STMicroelectronics, ULN2075B Datasheet - Page 9

• Manufacturer Part Number: ULN2075B
• Description: IC DARL SW QUAD 80V 16-POWERDIP
• Manufacturer: STMicroelectronics
• Type: Darlington Arrayr

Specifications of ULN2075B

• Voltage - Supply: 50V
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Package Type: Powerdip
• Power Dissipation: 1 W (Max.) @ 70 °C
• Temperature Range, Junction, Operating: -20 to +85 °C
• Voltage, Saturation, Collector To Emitter: 1.1 V (Max.) @ 500 mA
• Voltage, Sustaining, Collector To Emitter: 50 V (Min.) @ 100 mA
• Collector Emitter Voltage V(br)ceo: 80V
• Power Dissipation Pd: 1W
• Dc Collector Current: 1.5A
• Operating Temperature Range: -20°C To +85°C
• No. Of Pins: 16
• Continuous Collector Current Ic: 1.75A
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Drivers/receivers: -
• Protocol: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device
• Other names: 497-3084-5

6
Figure 14. Example of P.C. board area which
Figure 16. Maximum dissipated power and
Mounting instructions
The R
circuit board
The diagram of
function of the side " " of two equal square copper areas having a thickness of 35 µ (1.4
mils).
During soldering the pins temperature must not exceed 260 °C and the soldering time must
not be longer than 12 seconds.
The external heatsink or printed circuit copper area must be connected to electrical ground.
is used as heatsink
junction to ambient thermal
resistance vs. side " "
thJA
can be reduced by soldering the GND pins to a suitable copper area of the printed
(Figure
Figure 16
14) or to an external heatsink
shows the maximum dissipated power P
Figure 15. External heatsink mounting
Figure 17. Maximum allowable power
(Figure
example
dissipation vs. ambient
temperature
15).
TOT
and the R
thJA
as a
9/13