MC9S08GW64CLK Freescale Semiconductor, MC9S08GW64CLK Datasheet - Page 13

• Manufacturer Part Number: MC9S08GW64CLK
• Description: S08 8bit Microcontroller
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GW64CLK

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LCD, PWM, WDT
• Number Of I /o: 45
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 16x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Processor Series: MC9S08GW64
• Core: S08
• Data Bus Width: 8 bit
• Data Ram Size: 4032 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 57
• Number Of Timers: 3
• Operating Supply Voltage: - 0.3 V to + 3.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Supply Current (max): 60 uA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.6
This section includes information about power supply requirements and I/O pin characteristics.
Freescale Semiconductor
Num C
1
2
3
4
C Output high
P
C
C Output high
P
C
D Output high
DC Characteristics
Operating Voltage
voltage
voltage
current
1
2
3
Parameter is achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted.
These pins meet JESD78A Class II (section 1.2) Level A (section 1.3) requirement of 100mA.
This pin meets JESD78A Class II (section 1.2) Level B (section 1.3) characterization to 62mA.
No.
1
2
3
4
Characteristic
Max total I
Human body model (HBM)
Machine Model (MM)
Charge device model (CDM)
Latch-up current at T
(applies to all pins except pin
31EXTAL1 and pin 30 XTAL1 in
80-pin package, applies to all pins
except pin 23 EXTAL1 and pin 24
XTAL1 in 64-pin package)
Latch-up current at T
(applies to pin 31EXTAL1 and pin
30 XTAL1 in 80-pin package,
applies to pin 23 EXTAL1 and pin
24 XTAL1 in 64-pin package)
Table 7. ESD and Latch-Up Protection Characteristics
high-drive strength
All LCD/GPIO pins
All LCD/GPIO pins
high-drive strength
low-drive strength
low-drive strength
All non-LCD pins
All non-LCD pins
OH
MC9S08GW64 Series MCU Data Sheet, Rev. 3
Rating
for all ports
Table 8. DC Characteristics
1
A
A
= 85C
= 85C
Symbol
I
V
V
OHT
OH
OH
Symbol
I
I
I
I
Load
Load
Load
Load
I
I
V
V
Load
Load
V
V
V
V
V
V
V
I
I
Condition
HBM
CDM
LAT
LAT
DD
DD
DD
DD
MM
DD
DD
= –0.6 mA
= –0.5 mA
= –2.5 mA
= –10 mA
= –3 mA
= –1 mA
> 2.7 V
> 1.8 V
> 2.7 V
> 1.8 V
>1.8 V
>1.8 V
2000
100
±200
500
62
Min
3
2
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
Min
1.8
—
– 0.5
– 0.5
– 0.5
– 0.5
– 0.5
– 0.5
Max
—
—
—
—
—
Electrical Characteristics
Typ
—
—
—
—
—
—
—
1
Unit
mA
mA
V
V
V
Max
100
3.6
—
—
—
—
—
—
Unit
mA
V
V
V
13