ISP1301BS ST-Ericsson Inc, ISP1301BS Datasheet - Page 46

• Manufacturer Part Number: ISP1301BS
• Description: IC USB OTG TRANSCEIVER 24-HVQFN
• Manufacturer: ST-Ericsson Inc
• Type: Transceiverr

Specifications of ISP1301BS

• Number Of Drivers/receivers: 1/1
• Protocol: USB 2.0
• Voltage - Supply: 2.7 V ~ 4.5 V
• Mounting Type: Surface Mount
• Package / Case: 24-VQFN Exposed Pad, 24-HVQFN, 24-SQFN, 24-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-1166; ISP1301BS,157

Philips Semiconductors
20. Abbreviations
21. References
ISP1301_3
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 53:
[1]
[2]
[3]
[4]
[5]
Acronym
ASIC
ATX
HNP
ESD
I
IC
LSB
OTG
PDA
PLD
POR
PORP
SE0
SOF
SRP
USB
USB-IF
2
C-bus
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
ECN_27%_Resistor (Pull-up/pull-down Resistors ECN)
Universal Serial Bus Specification Rev. 2.0
On-The-Go Supplement to the USB Specification Rev. 1.0a
On-The-Go Transceiver Specification (CEA-2011) Rev. 1.0
The I2C-bus specification; version 2.1
Abbreviations
Description
Application-Specific Integrated Circuit
Analog USB Transceiver
Host Negotiation Protocol
ElectroStatic Discharge
Inter IC-bus
Integrated Circuit
Least Significant Bit
On-The-Go
Personal Digital Assistant
Programmable Logic Device
Power-On Reset
Power-On Reset Pulse
Single-Ended Zero
Start-Of-Frame
Session Request Protocol
Universal Serial Bus
USB Implementers Forum
Rev. 03 — 21 February 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
USB OTG transceiver
ISP1301
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