LPC1837FET256,551 NXP Semiconductors, LPC1837FET256,551 Datasheet

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LPC1837FET256,551

Manufacturer Part Number
LPC1837FET256,551
Description
Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
Manufacturer
NXP Semiconductors
Series
LPC18xxr

Specifications of LPC1837FET256,551

Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
 Details
Other names
935293795551
Fastest Cortex-M3 MCU, Largest SRAM,
High Speed USB
The LPC1800 series of low power, high-performance Cortex-M3 MCUs features frequencies up to
150 MHz and flexible Dual-Bank Flash for the highest reliability in-application re-programming.
Key features
4 150 MHz, 32-bit ARM Cortex-M3
4 Up to 1 MB dual-bank Flash
4 Up to 200 KB SRAM
4 Up to 4 KB EEPROM
4 Memory Protection Unit (MPU)
4 Two high-speed USB 2.0 interfaces, on-chip high-speed PHY
4 10/100T Ethernet MAC with MII and RMII interfaces
4 LCD controller with 1024 x 768 pixel display resolution
4 Innovative Quad SPI Flash Interface (SPIFI)
4 State Configurable Timer (SCT) Subsystem
4 Two CAN 2.0B
4 AES Decryption with 128-bit secure OTP key storage
4 Up to 164 GPIO
4 Pin-compatible with the LPC4300 series
Additional features
4 8-channel GPDMA controller
4 Two 8-channel, 10-bit ADCs and one 10-bit DAC
4 Motor Control PWM and Quadrature Encoder Interface
4 Four UARTs, smart card interface
4 Two Fast-mode I
4 Temperature range: –40 to +85 ºC
(400 K samples per second)
2
C, two I
2
S, two SSP/SPI
NXP 150 MHz, 32-bit
Cortex-M3
LPC1800
Lower power and high performance
The LPC1800 - designed using NXP’s ultra low-leakage 90 nm
process technology - is optimized for low power operation at
very low frequencies all the way through to 150 MHz maximum
performance from either Flash or RAM. This performance
provides maximum connectivity and bandwidth options for
a wide range of demanding applications including power
conversion, lighting, motor control and audio applications.
Large internal memory
The LPC1800 offers the industry’s largest on-chip SRAM for
a Cortex-M3 with up to 200 KB provided in multiple banks.
A flexible dual-bank Flash architecture offers the highest
reliability in-application re-programming, and allows for
non-stop Flash operation.
Extensive peripheral set
The LPC1800 also features two new innovative peripherals:
a flexible quad-SPI interface and a State Configurable Timer
subsystem. The LPC1800 is the first microcontroller to provide
a seamless high-speed interface that will connect with virtually
all SPI and quad-SPI manufacturers. The LPC1800’s State
Configurable Timer Subsystem comprises of a timer array
with a state machine enabling complex functionality including
microcontrollers

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LPC1837FET256,551 Summary of contents

Page 1

Fastest Cortex-M3 MCU, Largest SRAM, High Speed USB The LPC1800 series of low power, high-performance Cortex-M3 MCUs features frequencies up to 150 MHz and flexible Dual-Bank Flash for the highest reliability in-application re-programming. Key features 4 150 MHz, 32-bit ARM ...

Page 2

... NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice ...

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