PCA9555PW,118 NXP Semiconductors, PCA9555PW,118 Datasheet - Page 30

• Manufacturer Part Number: PCA9555PW,118
• Description: IC I/O EXPANDER I2C 16B 24TSSOP
• Manufacturer: NXP Semiconductors

Specifications of PCA9555PW,118

• Package / Case: 24-TSSOP
• Interface: I²C, SMBus
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: CMOS
• Number Of Lines (input / Output): 8 / 8
• Operating Supply Voltage: 2.3 V to 5.5 V
• Power Dissipation: 200 mW
• Operating Temperature Range: - 40 C to + 85 C
• Input Voltage: 2.3 V to 5.5 V
• Logic Type: I2C, SMBus
• Maximum Clock Frequency: 400 KHz
• Maximum Operating Frequency: 0 KHz to 400 KHz
• Mounting Style: SMD/SMT
• Number Of Input Lines: 8
• Number Of Output Lines: 8
• Output Current: +/- 50 mA
• Output Voltage: 1.7 V to 4.1 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1058-2; 935269569118; PCA9555PW-T

NXP Semiconductors
16. Soldering of through-hole mount packages
PCA9555_8
Product data sheet
16.1 Introduction to soldering through-hole mount packages
16.2 Soldering by dipping or by solder wave
16.3 Manual soldering
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Fig 32. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 08 — 22 October 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
16-bit I
2
C-bus and SMBus I/O port with interrupt
temperature
peak
stg(max)
PCA9555
© NXP B.V. 2009. All rights reserved.
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