DS33X42+ Maxim Integrated Products, DS33X42+ Datasheet - Page 340

IC MAPPING ETHERNET 256CSBGA

DS33X42+

Manufacturer Part Number
DS33X42+
Description
IC MAPPING ETHERNET 256CSBGA
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of DS33X42+

Applications
Data Transport
Interface
Parallel/Serial
Voltage - Supply
1.8V, 2.5V, 3.3V
Package / Case
256-CSBGA
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 12-2. DC Electrical Characteristics
(T
Note 1: Typical total power consumption for the DS33X162 at 400Mbps is approximately 1W.
Note 2: All outputs loaded with rated capacitance; all inputs between VDD and VSS; inputs with pullups connected to VDD.
Note 3: All disable and power-down bits set, RST held low, outputs not loaded.
Rev: 063008
I/O Supply Current (VDD3.3 = 3.465V)
Core Supply Current (VDD1.8 = 1.89)
AVDD 1.8V Supply Current
VDDQ 2.5V Supply Current
Power-Down I/O Current
Power-Down Core Current
Power-Down AVDD Current
Power-Down VDDQ Current
Lead Capacitance
Input Leakage
Input Leakage (pins with internal pull-up)
Output Leakage (when Hi-Z)
Output Voltage (I
Output Voltage (I
Output Voltage (I
Output Voltage (I
Output Voltage DDR SDRAM
(I
Output Voltage DDR SDRAM
(I
________________________________________________ DS33X162/X161/X82/X81/X42/X41/X11/W41/W11
j
OH
OL
= -40°C to +85°C.)
= +8.1mA)
= -8.1mA)
PARAMETER
OH
OL
OH
OL
= +4.0mA)
= +12.0mA)
= -4.0mA)
= -8.0mA)
SYMBOL
I
I
I
V
I
V
DDCORE
PDCORE
PDVDDQ
PDAVDD
I
I
I
I
OHDDR
VDDQ
V
V
OLDDR
AVDD
V
V
DDIO
C
PDIO
I
I
I
ILP
LO
IL
OH
OL
OH
OL
IO
12 ma outputs
CONDITIONS
DDR SDRAM
DDR SDRAM
4 ma outputs
4 ma outputs
8 ma outputs
Notes 1, 2
Notes 1, 2
Notes 1, 2
Notes 1, 2
outputs
outputs
Note 3
Note 3
Note 3
Note 3
-100
MIN
-10
-10
2.4
2.4
1.9
TYP
260
120
30
5
7
MAX
300
150
+10
+10
-10
0.4
0.4
0.4
50
10
1
1
5
1
340 of 375
UNITS
mA
mA
mA
mA
mA
mA
mA
mA
μA
μA
μA
pF
V
V
V
V
V
V

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