UJA1069TW24/3V0:51 NXP Semiconductors, UJA1069TW24/3V0:51 Datasheet - Page 59

• Manufacturer Part Number: UJA1069TW24/3V0:51
• Description: IC LIN FAIL-SAFE 24-HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1069TW24/3V0:51

• Applications: Automotive
• Interface: LIN (Local Interconnect Network)
• Voltage - Supply: 3V
• Package / Case: 24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935280016512; UJA1069TW24/3V0; UJA1069TW24/3V0

NXP Semiconductors
Fig 28. Package outline SOT864-1 (HTSSOP24)
UJA1069_3
Product data sheet
HTSSOP24: plastic thermal enhanced thin shrink small outline package; 24 leads;
body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
SOT864-1
VERSION
OUTLINE
Z
max
1.1
A
24
1
0.15
0.05
y
A
1
0.95
0.80
A
2
pin 1 index
0.25
IEC
e
A
3
exposed die pad
0.30
0.19
b
p
D
D
H
0.2
0.1
c
MO-153
JEDEC
D
7.9
7.7
(1)
b
REFERENCES
p
D
4.3
4.1
0
Rev. 03 — 10 September 2007
h
E
4.5
4.3
w
(2)
13
12
M
JEITA
3.3
3.1
E
E
h
scale
h
2.5
0.65
e
c
6.6
6.2
H
E
A
2
A
1
L
1
5 mm
detail X
0.75
0.50
L
p
0.2
v
LIN fail-safe system basis chip
H
E
PROJECTION
E
EUROPEAN
0.13
w
L
0.1
y
L
p
0.5
0.2
Z
UJA1069
© NXP B.V. 2007. All rights reserved.
(A
A
3
)
8
0
ISSUE DATE
04-09-23
05-12-06
X
A
v
SOT864-1
M
59 of 64
A