HSDL-3210-021 Lite-On Electronics, HSDL-3210-021 Datasheet
HSDL-3210-021
Specifications of HSDL-3210-021
Related parts for HSDL-3210-021
HSDL-3210-021 Summary of contents
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... IrDA® Compliant Low Power 1.15 Mbit/s Infrared Transceiver Data Sheet Description The HSDL-3210 is one of a new generation of low-cost Infrared (IR) transceiver modules from Lite-On Technology. It features one of the smallest footprint in the industry 3.0 D mm. Although the supply voltage can range from 2 3.6 V, the LED is driven by an internal constant current source SIR data rates and 150 mA at MIR data rates ...
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... TXD/SWDAT Transmitter Data Input/ Serial Write Data 8 VLED LED Supply Voltage - SHIELD EMI Shield 2 Ordering Information Part Number Packaging Type HSDL-3210-021 Tape and Reel ADJUSTABLE OPTICAL POWER SERIAL TRANSCEIVER CONTROL Notes Connect to system ground. Connect to ASIC logic controller V CC Regulated, 2.7 to 3.6 Volts Use as clock input pin for programming mode ...
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... F, 20%, Tantalum C2 1.0 F, 20%, Tantalum C3 0.47 F, 20%, Ceramic Note: 1. C1, which is optional, must be placed within 0 the HSDL-3210 to obtain optimum noise immunity. Serial Interface for Transceiver Control The Serial Interface for Transceiver Control (STC) is used to control and program the features of the transceiver. These ...
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Table 2. Serial Interface for Transceiver Control – Read Data Format IrDA Data –data rates SIR (2.4 to 115.2 Kbps) MIR (0.576, 1.152 Mbps) I/O Control SD Normal Mode SD Sleep Mode RXD disable RXD enable TXD disable TXD enable ...
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Caution: The BiCMOS inherent to this design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or ...
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Electrical and Optical Specifications Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values are and 3.0 V unless otherwise noted. Parameter Receiver RXD ...
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V OH 90% 50% 10 Figure 4. RXD output waveform. t LED ON 90% 50% 10% LED OFF t r Figure 5. LED optical waveform. TXD LED t pw (MAX.) Figure 6. TXD ‘Stuck ...
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Package Dimensions MOUNTING 2.05 RECEIVER 1.175 2.85 3.0 1.85 0.6 Figure 8. Package outline dimensions. 8 4.0 CENTER 1.025 C L EMITTER 2.2 2.5 1.05 1.25 2.55 4.0 8.0 2 PIN 1 3.325 6.65 0.35 COPLANARITY ...
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Tape and Reel Dimensions 4.0 ± 0.1 UNIT: mm 1.5 POLARITY PIN 8: LED A 8.4 ± 0.1 PIN 1: CX 3.4 ± 0.1 0.4 ± 0.05 2.8 ± 0.1 EMPTY PARTS MOUNTED (40 mm MIN.) DETAIL A LABEL Figure ...
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... Moisture-Proof Packaging All HSDL-3210 options are shipped in moisture-proof packaging. Once opened, moisture absorption begins. This product is compliant to JEDEC level 4. UNITS IN A SEALED MOISTURE-PROOF OPENED (UNSEALED) LESS THAN 30°C, AND LESS THAN NO BAKING YES IS NECESSARY THAN 72 HOURS PERFORM RECOMMENDED BAKING CONDITIONS Figure 10. Baking conditions chart. ...
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... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed –3 C per sec- ond maximum. This limitation is necessary to allow the PC board and HSDL-3210 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3210 transceiver. ...
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Appendix A : SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 12. Stencil and PCBA. 1.1 Recommended Land Pattern MOUNTING CENTER 0.10 1.75 0.60 UNIT: mm Figure 13. Land pattern. ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure ad- equate printed solder paste vol- ...
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... V is connected the LED CC connection should be before the C1 cap. A reference layout of a 2-layer Lite-On evaluation board for HSDL-3210 based on the guidelines stated above is shown below. For more details, please refer to Lite-On Application Note 1114, Infrared Transceiver PC Board Layout for Noise Immunity. ...
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... TOUCH PANEL COM PORT PDA PLATFORM Interface to Recommended I/O chips The HSDL-3210’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb 1.152 Mbp/s is available at the RXD pin. The block diagram below shows how the IR port fits into a mobile phone and PDA platform ...
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... Activity on the SCLK line determines whether the trans- ceiver is to operate in the normal or STC mode. Please refer to Lite-On Application Note 1270 Serial Transceiver Control for Infrared Transceivers for further information on implementing STC using HSDL- 3210 as well as the lists of registers supported by HSDL- 3210. ...
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STC Bus Protocol and Timing Diagrams Bus Protocol A set of commands is provided to handle the various transactions between the master and the slave. The general format is shown in Figure 19 whereby communica- tions consist of a mandatory ...
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Bus Timing Diagrams The bus timings are designed to be simple and to minimize the effects of timing skew. This sec- tion discusses some key points with regard to bus timings and illustrates typical STC transac- tions with the use ...
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Bus Timing Sample Waveforms The following diagrams are sample waveforms for 2 byte write and read transactions and a 3 byte read transaction. (A) SET CONTROL REGISTER 1 TO MIR MODE 1st BYTE START C BIT INDEX ADDRESS SCLK SWDAT ...
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... Figure 25. Timing diagram. The link distance testing was done using typical HSDL-3210 units with National Semiconductor’s PC87109 3V Super I/O controller and SMC’s FDC37C669 and FDC37N769 Super I/O controllers link distance was demonstrated for SIR at full power. On the other hand, for MIR at full power link distance was demonstrated ...
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... Y IR TRANSPARENT WINDOW Z D Figure 26. Window design diagram. 21 from the HSDL-3210 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens 5.1 mm. The equations for computing the window dimen- sions are as follows 2*(Z + D)*tanA ...
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Module Depth Aperture Width (x, mm) (z) mm Max. 0 8.76 1 9.92 2 11.07 3 12.22 4 13.38 5 14.53 6 15.69 7 16.84 8 18.00 9 19.15 APERTURE WIDTH (X) vs. MODULE DEPTH ...
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Window Material Almost any plastic material will work as a window material. Poly- carbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make ...
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For company and product information, please go to our web site: http://optodatabook.liteon.com/databook/databook.aspx Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved. WWW.liteon.com or ...