LFXP20E-3FN256C Lattice, LFXP20E-3FN256C Datasheet - Page 381

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LFXP20E-3FN256C

Manufacturer Part Number
LFXP20E-3FN256C
Description
IC FPGA 19.7KLUTS 188I/O 256-BGA
Manufacturer
Lattice
Datasheet

Specifications of LFXP20E-3FN256C

Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFXP20E-3FN256C
Manufacturer:
SMD
Quantity:
2 000
Part Number:
LFXP20E-3FN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
100-ball csBGA BGA Breakout and Routing Examples
These examples place a MachXO PLD in a 8x8 mm, 0.5 mm pitch, 100-ball csBGA package (LXMXO640-
M100/MN100) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O utilization and a 4-layer
with about 15% fewer I/Os. The 4-layer (Example #2) design makes maximum use of via and trace geometry to
reduce layer count and ease fabrication while still maintaining high I/O usage.
Figure 14-4. CAM Artwork Screen Shots, Example #1, 100-ball csBGA
Layer 1 Primary
Layer 2 GND
Layer 3 Power
Layer 4 Secondary
14-6

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