BAS16H NXP Semiconductors, BAS16H Datasheet
BAS16H
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BAS16H Summary of contents
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... BAS16 series High-speed switching diodes Rev. 05 — 25 August 2008 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS316 BAS516 1.2 Features I High switching speed: t ...
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... Quick reference data Table 2. Symbol Per diode [1] When switched from I 2. Pinning information Table 3. Pin BAS16; BAS16T; BAS16W BAS16H; BAS16J; BAS316; BAS516 1 2 BAS16L 1 2 BAS16VV; BAS16VY [1] The marking bar indicates the cathode. BAS16_SER_5 Product data sheet Quick reference data Parameter ...
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... Table 4. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS316 BAS516 4. Marking Table 5. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS316 BAS516 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BAS16_SER_5 Product data sheet ...
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... BAS16 BAS16H BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS16J BAS316 BAS516 repetitive peak forward t current non-repetitive peak forward square wave current total power dissipation BAS16 T BAS16H T BAS16J T BAS16L T BAS16T T BAS16VV T BAS16VY T BAS16W T BAS316 T BAS516 T Rev. 05 — 25 August 2008 BAS16 series ...
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... Parameter Conditions junction temperature ambient temperature storage temperature Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient BAS16 BAS16H BAS16J BAS16L BAS16VV BAS16W thermal resistance from junction to tie-point BAS16 BAS16W Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes ...
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... Parameter Conditions forward voltage 150 mA F reverse current diode capacitance MHz; V BAS16; BAS16H; BAS16J; BAS16L; BAS16T; BAS16VV; BAS16VY; BAS16W; BAS316 BAS516 reverse recovery time forward recovery voltage 300 s; 0. Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes Min Typ [ [ ...
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... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.4 0.6 0.8 ( 150 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values ( ( ( ( ( 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAS16_SER_5 Product data sheet 006aab132 ...
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... output signal 100 ns; duty cycle 0.005 p 1.7 1.5 1 0.55 0.35 3.6 2.7 3.4 2.5 2 0.70 0.55 Package outline BAS16H (SOD123F (1) t mga882 1.2 1.0 0.25 0.10 04-11-29 © NXP B.V. 2008. All rights reserved ...
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... NXP Semiconductors 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 9. Package outline BAS16J (SOD323F/SC-90) 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 11. Package outline BAS16T (SOT416/SC-75) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 13 ...
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... Dimensions in mm Fig 15. Package outline BAS316 (SOD323/SC-76) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS16 SOT23 BAS16H SOD123F BAS16J SOD323F BAS16L SOD882 BAS16T SOT416 BAS16VV SOT666 BAS16VY ...
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... NXP Semiconductors 11. Soldering 3 1.7 Fig 17. Reflow soldering footprint BAS16 (SOT23/TO-236AB) 4.6 2.6 Fig 18. Wave soldering footprint BAS16 (SOT23/TO-236AB) BAS16_SER_5 Product data sheet 3.3 2.9 1 2 1.4 2.8 4.5 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes ...
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... NXP Semiconductors Fig 19. Reflow soldering footprint BAS16H (SOD123F) 1.65 Fig 20. Reflow soldering footprint BAS16J (SOD323F) BAS16_SER_5 Product data sheet 4.4 4 2.9 1.6 2.1 1.6 1 Reflow soldering is the only recommended soldering method. Dimensions in mm 3.05 2.2 2.1 0.95 0 ...
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... NXP Semiconductors 0.9 Fig 21. Reflow soldering footprint BAS16L (SOD882) Fig 22. Reflow soldering footprint BAS16T (SOT416/SC-75) BAS16_SER_5 Product data sheet 1.3 0 Reflow soldering is the only recommended soldering method. 2.2 1.7 0.85 0 1.3 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes R0 ...
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... NXP Semiconductors 2 1.7 Fig 23. Reflow soldering footprint BAS16VV (SOT666) Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88) BAS16_SER_5 Product data sheet 2.75 2.45 2.1 1.6 0.538 0.55 1.075 (2 ) 1 Reflow soldering is the only recommended soldering method. 2.65 2.35 1.5 0.6 ...
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... NXP Semiconductors 4.5 Fig 25. Wave soldering footprint BAS16VY (SOT363/SC-88) Fig 26. Reflow soldering footprint BAS16W (SOT323/SC-70) BAS16_SER_5 Product data sheet 1.3 1.3 2.45 5.3 2.65 1.85 1.325 2 0 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes 1.5 0.3 2.5 1 ...
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... NXP Semiconductors 3.65 2.1 Fig 27. Wave soldering footprint BAS16W (SOT323/SC-70) 1.65 Fig 28. Reflow soldering footprint BAS316 (SOD323/SC-76) BAS16_SER_5 Product data sheet 4.6 2.575 1.425 (3 ) 3.05 2.1 0.95 2 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes 1.8 Dimensions in mm ...
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... NXP Semiconductors 2.75 Fig 29. Wave soldering footprint BAS316 (SOD323/SC-76) Fig 30. Reflow soldering footprint BAS516 (SOD523/SC-79) BAS16_SER_5 Product data sheet 5 2 2.15 1.1 1 Reflow soldering is the only recommended soldering method. Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes ...
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... Product specification Product data sheet Product specification Product specification Product specification Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes Change notice Supersedes - BAS16_4 BAS16H_1 BAS16J_1 BAS16L_1 BAS16T_1 BAS16VV_BAS16VY_3 BAS16W_4 BAS316_4 BAS516_1 condition V from for maximum value from 1 0.5 A for V ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Revision history ...