BGM1012 NXP Semiconductors, BGM1012 Datasheet
BGM1012
Specifications of BGM1012
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BGM1012 Summary of contents
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... DATA SHEET dbook, halfpage BGM1012 MMIC wideband amplifier Product specification Supersedes data of 2002 May 16 DISCRETE SEMICONDUCTORS MBD128 2002 Sep 06 ...
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... PINNING at 1 GHz) CONDITIONS GHz GHz GHz CAUTION 2 Product specification PIN DESCRIPTION GND2 3 RF out 4 GND1 Top view MAM455 Marking code: C2-. Fig.1 Simplified outline (SOT363) and symbol. TYP. 3 14.6 20.1 4.8 9.7 BGM1012 MAX. UNIT 4 V mA dB dB dBm ...
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... SYMBOL PARAMETER R thermal resistance from junction to th j-s solder point 2002 Sep 06 CONDITIONS RF input AC coupled 90 CONDITIONS 90 200 mW; T tot s 3 Product specification BGM1012 MIN. MAX. UNIT 200 mW 65 C +150 C 150 ...
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... GHz GHz f = 2.2 GHz at s 3 dB below flat gain at 1 GHz 3 GHz f = 2.2 GHz GHz f = 2.2 GHz gain compression GHz gain compression 2.2 GHz GHz f = 2.2 GHz GHz f = 2.2 GHz 4 Product specification BGM1012 MIN. TYP. MAX. UNIT 20.4 21 ...
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... MMIC wideband amplifier APPLICATION INFORMATION Figure 2 shows a typical application circuit for the BGM1012 MMIC. The device is internally matched to 50 , and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF for applications above 100 MHz ...
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... O Fig.8 Output reflection coefficient (s 6 Product specification 1.0 0.8 45° +2 0.6 0 0° 0 −5 −2 −45° MLD910 1.0 ); typical values. 11 1.0 0.8 45° +2 0.6 0 0° 0 −5 −2 −45° MLD911 1.0 ); typical values. 22 BGM1012 ...
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... 18 14.6 mA 10 function of 21 frequency; typical values (1) (3) 0 −10 −20 −40 −30 − 3 2 2.2 GHz; typical values. Product specification BGM1012 MLD913 (1) (2) (3) 3000 4000 f (MHz) MLD915 (2) − (dBm) ...
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... 18 Fig.13 Noise figure as a function of frequency; typical values. 2002 Sep 06 MLD916 handbook, halfpage 2000 3000 f (MHz Fig.14 Stability factor as a function of frequency 1000 2000 = 30 dBm = 14.6 mA typical values. Product specification BGM1012 MLD917 3000 4000 f (MHz) ...
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Scattering parameters = 30 dBm 14.6 mA (MHz) MAGNITUDE ANGLE MAGNITUDE (ratio) (deg) 100 0.25122 14.607 200 0.27070 2.759 7.969 400 ...
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... OUTLINE VERSION IEC SOT363 2002 Sep scale 2.2 1.35 2.2 1.3 0.65 1.8 1.15 2.0 REFERENCES JEDEC JEITA SC- detail 0.45 0.25 0.2 0.2 0.1 0.15 0.15 EUROPEAN PROJECTION Product specification BGM1012 SOT363 ISSUE DATE 04-11-08 06-03-16 ...
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... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 11 Product specification BGM1012 DEFINITION ...
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... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 12 Product specification BGM1012 ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...