ISP1122AD NXP Semiconductors, ISP1122AD Datasheet - Page 41

• Manufacturer Part Number: ISP1122AD
• Manufacturer: NXP Semiconductors

Specifications of ISP1122AD

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: SO
• Rad Hardened: No
• Lead Free Status / Rohs Status: Not Compliant

Philips Semiconductors
Fig 24. SDIP32 package outline.
9397 750 08958
Product data
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
L
mm
VERSION
SOT232-1
OUTLINE
Z
32
1
max.
4.7
pin 1 index
A
min.
0.51
A
1
IEC
max.
3.8
A
2
1.3
0.8
b
e
0.53
0.40
JEDEC
b
D
1
REFERENCES
0
Rev. 03 — 30 October 2001
0.32
0.23
c
b
29.4
28.5
D
(1)
scale
EIAJ
5
E
9.1
8.7
(1)
1.778
e
10 mm
17
16
b
1
10.16
e
1
A
1
w
A
2
E
M
3.2
2.8
L
A
PROJECTION
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
EUROPEAN
10.7
10.2
M
E
c
USB stand-alone hub
12.2
10.5
M
ISP1122A
H
(e )
M
M
1
H
E
ISSUE DATE
0.18
92-11-17
95-02-04
w
SOT232-1
max.
1.6
Z
40 of 48
(1)