BUK139-50DL NXP Semiconductors, BUK139-50DL Datasheet

BUK139-50DL

Manufacturer Part Number
BUK139-50DL
Description
Manufacturer
NXP Semiconductors
Type
Power MOSFETr
Datasheet
1.BUK139-50DL.pdf (6 pages)

Specifications of BUK139-50DL

Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.1Ohm
Drain-source On-volt
50V
Continuous Drain Current
16A
Power Dissipation
65W
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2 +Tab
Package Type
DPAK
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Euro Chip Distribution Euro Chip Distribution
Part Number:
BUK139-50DL
Quantity:
20 000
Philips Semiconductors
DESCRIPTION
Monolithic temperature and
overload protected logic level power
MOSFET in TOPFET2 technology
assembled in a 3 pin surface mount
plastic package.
APPLICATIONS
General purpose switch for driving
in automotive systems and other
applications.
FEATURES
PINNING - SOT428
July 2001
Logic level TOPFET
D-PAK version of BUK118-50DL
PIN
tab
lamps
motors
solenoids
heaters
TrenchMOS output stage
Current limiting
Overload protection
Overtemperature protection
Protection latched reset by input
5 V logic compatible input level
Control of output stage and
supply of overload protection
circuits derived from input
Low operating input current
permits direct drive by
micro-controller
ESD protection on all pins
Overvoltage clamping for turn
off of inductive loads
1
2
3
input
drain
source
drain
DESCRIPTION
QUICK REFERENCE DATA
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
INPUT
SYMBOL
V
I
P
T
R
I
D
ISL
j
DS
D
DS(ON)
PARAMETER
Continuous drain source voltage
Continuous drain current
Total power dissipation
Continuous junction temperature
Drain-source on-state resistance
Input supply current
1
tab
1
2
3
Fig.1. Elements of the TOPFET.
PROTECTION
LOGIC AND
RIG
SYMBOL
CLAMP
V
O / V
IS
= 5 V
I
TOPFET
Product specification
BUK139-50DL
P
MAX.
150
650
50
16
65
50
D
S
POWER
MOSFET
SOURCE
DRAIN
Rev 2.000
UNIT
m
˚C
W
V
A
A

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BUK139-50DL Summary of contents

Page 1

... Total power dissipation D T Continuous junction temperature j R Drain-source on-state resistance DS(ON) I Input supply current ISL FUNCTIONAL BLOCK DIAGRAM INPUT LOGIC AND PROTECTION Fig.1. Elements of the TOPFET. PIN CONFIGURATION tab Product specification BUK139-50DL MAX. UNIT 150 ˚ 650 IS DRAIN CLAMP POWER MOSFET RIG ...

Page 2

... Human body model 250 pF 1.5 k CONDITIONS ˚ ˚ 250 Hz mb REQUIRED CONDITION 5 CONDITIONS - minimum footprint FR4 PCB the over temperature trip operates to protect the switch. j(TO) 2 Product specification BUK139-50DL MIN. MAX ˚C - self - limited 125 ˚ - -55 175 - 150 - 260 MIN. MAX. ...

Page 3

... A; t 300 300 4 CONDITIONS V;T = 25˚ device trips if P > D(TO) which determines trip time according to the formula ln DSC . IS 3 Product specification BUK139-50DL MIN. TYP. MAX 0. 100 = 25 ˚ ˚ 100 = 25 ˚ MIN. TYP. MAX. = 25˚ 120 160 1 200 350 600 150 ...

Page 4

... CONDITIONS normal operation; protection latched; 1 reset time t 100 < IS1 IS2 Refer to waveform figure and test circuit. L CONDITIONS Product specification BUK139-50DL MIN. TYP. MAX. 0 25˚C 1.1 1.6 2 100 220 400 195 330 200 400 650 130 ...

Page 5

... REFERENCES JEDEC EIAJ 1 , centre pin connected to mounting base. 5 Product specification BUK139-50DL SOT428 max. max. min. 0.7 10.4 2.95 0.5 0.2 0.2 0.5 9.6 2.55 ...

Page 6

... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 6 Product specification BUK139-50DL Rev 2.000 ...

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