MT48LC8M16LFB4-8 Micron Technology Inc, MT48LC8M16LFB4-8 Datasheet - Page 78

• Manufacturer Part Number: MT48LC8M16LFB4-8
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48LC8M16LFB4-8

• Organization: 8Mx16
• Density: 128Mb
• Address Bus: 14b
• Access Time (max): 19/8/7ns
• Maximum Clock Rate: 125MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 100mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Figure 58:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. L 10/07 EN
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
11.20 ±0.10
90X Ø0.45
0.10 A
90-Ball FBGA, “F5/B5” Package (x32 Device), 8mm x 13mm
BALL A9
5.60 ±0.05
Notes:
A
0.65 ±0.05
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.025mm.
3. Package width and length do not include mold protrusion; allowable mold protrusion is
4. Topside part marking decoder can be found at http://www.micron.com/support/fbga/
0.25mm per side.
decoder.aspx.
3.20
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
78
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
128Mb: x16, x32 Mobile SDRAM
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
BALL A1 ID