AM29F010-45PC Spansion Inc., AM29F010-45PC Datasheet - Page 2

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AM29F010-45PC

Manufacturer Part Number
AM29F010-45PC
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of AM29F010-45PC

Cell Type
NOR
Density
1Mb
Access Time (max)
45ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
17b
Operating Supply Voltage (typ)
5V
Operating Temp Range
0C to 70C
Package Type
PDIP
Program/erase Volt (typ)
4.75 to 5.25V
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (max)
5.25V
Word Size
8b
Number Of Words
128K
Supply Current
30mA
Mounting
Through Hole
Pin Count
32
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29F010-45PC
Manufacturer:
AMD
Quantity:
20 000
GENERAL DESCRIPTION
The Am29F010 is a 1 Mbit, 5.0 Volt-only Flash memory
organized as 131,072 bytes. The Am29F010 is offered
in 32-pin PLCC, TSOP, and PDIP packages. The byte-
wide data appears on DQ0-DQ7. The device is de-
signed to be programmed in-system with the standard
system 5.0 Volt V
quired for program or erase operations. The device can
also be programmed or erased in standard EPROM
programmers.
The standard device offers access times of 45, 55, 70,
90, and 120 ns, allowing high-speed microprocessors
to operate without wait states. To eliminate bus con-
tention the device has separate chip enable (CE#),
write enable (WE#) and output enable (OE) controls.
The device requires only a single 5.0 volt power sup-
ply for both read and write functions. Internally gener-
ated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Com-
mands are written to the command register using stan-
dard microprocessor write timings. Register contents
serve as input to an internal state machine that controls
the erase and programming circuitry. Write cycles also
internally latch addresses and data needed for the pro-
gramming and erase operations. Reading data out of
the device is similar to reading from other Flash or
EPROM devices.
Device programming occurs by executing the program
command sequence. This invokes the Embedded Pro-
gram algorithm—an internal algorithm that automati-
cally times the program pulse widths and verifies
proper cell margin.
2
CC
supply. A 12.0 volt V
PP
is not re-
Am29F010
Device erasure occurs by executing the erase com-
mand sequence. This invokes the Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by reading the DQ7 (Data#
Polling) and DQ6 (toggle) status bits. After a program
or erase cycle has been completed, the device is ready
to read array data or accept another command.
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is erased
when shipped from the factory.
The hardware data protection measures include a
low V
during power transitions. The hardware sector pro-
tection feature disables both program and erase oper-
ations in any combination of the sectors of memory,
and is implemented using standard EPROM program-
mers.
The system can place the device into the standby mode.
Power consumption is greatly reduced in this mode.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
h i gh est l eve l s o f qu al i ty, r el i a bi l i t y, a nd c o s t
effectiveness. The device electrically erases all bits
within a sector simultaneously via Fowler-Nordheim
tunneling. The bytes are programmed one byte at a
time using the EPROM programming mechanism of hot
electron injection.
CC
detector automatically inhibits write operations

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