PCD3316T NXP Semiconductors, PCD3316T Datasheet - Page 26

• Manufacturer Part Number: PCD3316T
• Manufacturer: NXP Semiconductors

Specifications of PCD3316T

• Process Technology: CMOS
• Operating Frequency (max): 3580kHz
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Philips Semiconductors
9397 750 04824
Product specification
13.4 Manual soldering
13.5 Package related soldering information
Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 C.
Table 19: Suitability of surface mount IC packages for wave and reflow soldering
[1]
[2]
[3]
[4]
[5]
Package
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
methods
11 March 1999
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
[2]
© Philips Electronics N.V. 1999. All rights reserved.
[3] [4]
[5]
PCD3316
CIDCW receiver
Reflow
suitable
suitable
suitable
suitable
suitable
[1]
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