TDA6500TT NXP Semiconductors, TDA6500TT Datasheet - Page 31

TDA6500TT

Manufacturer Part Number
TDA6500TT
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA6500TT

Pin Count
32
Screening Level
Commercial
Package Type
TSSOP
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA6500TT
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
TDA6500TT/C4
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Company:
Part Number:
TDA6500TT/C4
Quantity:
2 000
Philips Semiconductors
14. Package outline
Fig 17. Package outline SOT487-1 (TSSOP32)
9397 750 15057
Product data sheet
TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT487-1
32
1
Z
max.
y
1.1
A
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
e
D
0.30
0.19
b p
0.20
0.09
MO-153
JEDEC
c
5 V mixer/oscillator and synthesizer for PAL and NTSC standards
REFERENCES
D
11.1
10.9
(1)
0
Rev. 02 — 14 June 2005
E
6.2
6.0
(2)
b p
17
16
JEITA
scale
0.65
2.5
e
w
M
c
H E
8.3
7.9
5 mm
A
L
1
2
A
1
TDA6500; TDA6501
0.75
0.50
L p
0.2
v
H
E
E
PROJECTION
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
EUROPEAN
detail X
0.1
w
L
L p
0.1
y
0.78
0.48
(A )
Z
3
A
ISSUE DATE
99-12-27
03-02-18
8
0
o
o
A
SOT487-1
X
v
M
31 of 37
A

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