"CX24109-11Z,518" NXP Semiconductors, "CX24109-11Z,518" Datasheet - Page 36

• Manufacturer Part Number: "CX24109-11Z,518"
• Manufacturer: NXP Semiconductors

Specifications of "CX24109-11Z,518"

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
Table 16.
3.2
Figure 16.
CX24109_N_1
Product data sheet
Minimum Cutoff Frequency, F
Minimum Cutoff Frequency, F
Tuning Voltage Transfer Function
Passband Ripple
Stopband Attenuation
Stopband Attenuation
PWB Exposed Pad
5.070 REF.
0.965 REF.
Baseband Frequency Response
Mechanical Specifications
48-pin eTQFP Land Pattern
0.965 REF.
Parameter
PWB METALIZATION PATTERN
1 dB
1 dB
11 EQ SP @ 0.50 = 5.50
5.070 REF.
TYP
LAND PATTERN - 48 ETQFP
3x3 Array of
Thermal Vias
0.330 mm Dia.
Spacing TBD
Rev. 01 — 13 November 2008
0.250
0.500
1.000
Measured at maximum V
Measured at minimum V
4.570 REF.
5 × F
0 V < V
1.215 REF.
0 < Freq < F
F > 2.6 × F
Conditions
1 dB
Filtune
PWB SOLDER MASK PATTERN
< F < 2 GHz
Chapter 3: Parametric Data and Specifications
< 3.0 V
1 dB
1 dB
4.570 REF.
Filtune
Filtune
8.400 REF.
9.400 REF.
Min
1.4
27
35
45
—
—
Mask Opening
Thermal Vias Should be
Tinted Using 0.430 mm Dia.
Solder Mask
10.5
Typ
1.215 REF.
—
—
—
—
—
0.250
CX24109
Max
© NXP B.V. 2008. All rights reserved.
2.6
1.0
—
—
—
—
MHz/V
Units
102031_017
MHz
MHz
dB
dB
dB
36