TDA1308T/N2,112 NXP Semiconductors, TDA1308T/N2,112 Datasheet - Page 13

IC AMP AUDIO .08W STER AB 8SOIC

TDA1308T/N2,112

Manufacturer Part Number
TDA1308T/N2,112
Description
IC AMP AUDIO .08W STER AB 8SOIC
Manufacturer
NXP Semiconductors
Type
Class ABr
Datasheet

Specifications of TDA1308T/N2,112

Output Type
Headphones, 2-Channel (Stereo)
Package / Case
8-SOIC (3.9mm Width)
Max Output Power X Channels @ Load
80mW x 2 @ 32 Ohm
Voltage - Supply
3 V ~ 7 V, ±1.5 V ~ 3.5 V
Features
Depop, Short-Circuit Protection
Mounting Type
Surface Mount
Product
Class-AB
Available Set Gain
70 dB
Thd Plus Noise
0.03 %
Operating Supply Voltage
5 V
Supply Current
3 mA
Maximum Power Dissipation
25 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Audio Load Resistance
32 Ohms
Dual Supply Voltage
+/- 2.5 V
Input Bias Current (max)
10 pA
Input Offset Voltage
10 mV
Input Signal Type
Differential
Minimum Operating Temperature
- 40 C
Output Signal Type
Single
Supply Type
Single or Dual
Supply Voltage (max)
7 V
Supply Voltage (min)
3 V
Dc
0923
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-2090-5
935273874112
TDA1308T/N2
NXP Semiconductors
TDA1308
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 13. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 14 March 2011
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Class-AB stereo headphone driver
temperature
peak
TDA1308
© NXP B.V. 2011. All rights reserved.
001aac844
time
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