SA58631TK,115 NXP Semiconductors, SA58631TK,115 Datasheet - Page 7

• Manufacturer Part Number: SA58631TK,115
• Description: IC AMP AUDIO 3W MONO AB 8HVSON
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of SA58631TK,115

• Output Type: 1-Channel (Mono)
• Package / Case: 8-HVSON
• Max Output Power X Channels @ Load: 3W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 3 W
• Available Set Gain: 30 dB
• Thd Plus Noise: 0.15 %
• Operating Supply Voltage: 9 V
• Maximum Power Dissipation: 2300 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Bias Current (max): 0.5 uA
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 2.2 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935280877115; SA58631TK-G; SA58631TK-G

NXP Semiconductors
13. Application information
14. Test information
SA58631_2
Product data sheet
14.1 Test conditions
The junction to ambient thermal resistance, R
when the exposed die attach paddle is soldered to 32 cm
copper heat spreader on the demo PCB. The maximum sine wave power dissipation for
T
Thus, for T
The power dissipation versus ambient temperature curve
derating profiles with ambient temperature for three sizes of heat spreaders. For a more
modest heat spreader using 9.7 cm
R
increases to 83.3 K/W.
150 25
-------------------- -
150 85
-------------------- -
Fig 3. Application diagram of SA58631 BTL differential output configuration
amb
th(j-a)
27.7
27.7
–
–
= 25 C is:
is 31.25 K/W. When the package is not soldered to a heat spreader, the R
Gain
=
=
amb
4.5 W
2.35 W
1 F
C1
V I
=
= +85 C the maximum total power dissipation is:
2
11 k
R1
------ -
R2
R1
Rev. 02 — 12 October 2007
R2
56 k
C2
47 F
MODE
SVR
IN
IN+
2
(1.5 in
4
3
2
1
SA58631
2
) area on the top side of the PCB, the
6
7
th(j-a)
GND
= 27.7 K/W for the HVSON8 package
5
8
OUT
OUT+
2
(Figure
(5 in
100 nF
2
) area of 35 m (1 ounce)
3 W BTL audio amplifier
5) shows the power
R L
SA58631
© NXP B.V. 2007. All rights reserved.
100 F
002aac007
V
CC
th(j-a)
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