NCP4894MNR2G ON Semiconductor, NCP4894MNR2G Datasheet - Page 18

• Manufacturer Part Number: NCP4894MNR2G
• Description: IC AMP AUDIO PWR 1W DIFF 10-DFN
• Manufacturer: ON Semiconductor
• Type: Class ABr

Specifications of NCP4894MNR2G

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1.8W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Features: Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Output Power (typ): 1.08x1@8OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.006@8Ohm@1000mW%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 85dB
• Single Supply Voltage (min): 2.2V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 10
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCP4894MNR2G; NCP4894MNR2GOSTR

10X
2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
A B
NOTE 3
10X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
A
PACKAGE DIMENSIONS
C
SEATING
PLANE
http://onsemi.com
L1
MOLD CMPD
CASE 485C−01
MN SUFFIX
NCP4894
ISSUE A
Bottom View
A1
DFN10
(Optional)
DETAIL A
18
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.5651
(Optional)
Side View
DETAIL B
EDGE OF PACKAGE
É É É É É É
10X
2.1746
0.3008
EXPOSED Cu
10X
SOLDERING FOOTPRINT*
A3
2.6016
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
D
E
K
b
e
L
MILLIMETERS
MIN
0.80
0.00
0.18
2.45
1.75
0.35
0.00
DIMENSIONS: MILLIMETERS
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
MAX
1.00
0.05
0.30
2.55
1.85
0.45
0.03
0.5000 PITCH
1.8508
3.3048