TDA8004T NXP Semiconductors, TDA8004T Datasheet
TDA8004T
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TDA8004T Summary of contents
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... IC card interface Rev. 04 — 20 February 2006 1. General description The TDA8004T is a complete low cost analog interface for asynchronous smart cards. It can be placed between the card and the microcontroller with very few external components to perform all supply protection and control functions. 2. Features ...
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... V CC current card clock frequency deactivation sequence duration continuous total power T amb dissipation ambient temperature Description plastic small outline package; 28 leads; body width 7.5 mm Rev. 04 — 20 February 2006 TDA8004T Min 2 MHz - = 3 MHz MHz = DDP = 10 MHz ...
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... ALARM EN1 CLKUP EN2 PV CC GENERATOR EN5 SEQUENCER EN4 HORSEQ CLK EN3 THERMAL PROTECTION I/O TRANSCEIVER I/O TRANSCEIVER I/O TRANSCEIVER 18 n.c. Rev. 04 — 20 February 2006 TDA8004T IC card interface PGND 8 VUP 100 100 nF 14 CGND 16 RST RST BUFFER 15 CLOCK CLK BUFFER 10 PRES ...
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... S1 and S2) 8 I/O output of step-up converter (a 100 nF capacitor with ESR < 100 m must be connected to PGND card presence contact input (active LOW); if PRES or PRES is true, then the card is considered as present Rev. 04 — 20 February 2006 TDA8004T IC card interface 28 AUX2UC 27 AUX1UC 26 I/OUC XTAL2 25 XTAL1 ...
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... V 28 I/O auxiliary line to and from microcontroller (internal 10 k pull-up resistor connected to V and GND (see Figure 3). When V th2 hys(th2) Rev. 04 — 20 February 2006 TDA8004T ) 220 nF capacitors with ESR < 100 m will be higher 8. ...
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... XTAL Table 4). , the duty factors are dependent on the signal at XTAL1. XTAL , the duty factor on pin CLK may depending XTAL Rev. 04 — 20 February 2006 TDA8004T 100 nF capacitors of the , the IC will remain inactive whatever the levels after V has reached a level ...
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... I/OUC and I/OUC (approximately 200 ns), the N transistor on the slave side is d(edge) and then both sides return to their Idle states. d(edge) Figure 4). Rev. 04 — 20 February 2006 TDA8004T Figure CLK XTAL XTAL XTAL f XTAL , thus allowing operation with load ...
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... Product data sheet (V) ( LOW-to-HIGH transition ) rises from with a controlled slope (t with a slight delay) CC Rev. 04 — 20 February 2006 TDA8004T fce270 (mA) ( (ns) to GND) Figure 5 3T) (I/O, AUX1 and AUX2 ...
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... To Request (ATR) from the card. Fig 5. Activation sequence 8.7 Active state When the activation sequence is completed, the TDA8004T will be in the active state. Data is exchanged between the card and the microcontroller via the I/O lines. The TDA8004T is designed for cards without V erase the internal non-volatile memory). ...
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... dropping Rev. 04 — 20 February 2006 TDA8004T Figure 6 via resistor © Koninklijke Philips Electronics N.V. 2006. All rights reserved. IC card interface + T mge739 ...
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... DD PRES OFF V CC Deactivation caused by cards withdrawal Rev. 04 — 20 February 2006 TDA8004T 7 the temperature on the IC has become CC Deactivation caused by short circuit CC © Koninklijke Philips Electronics N.V. 2006. All rights reserved. IC card interface is detected ...
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... XTAL2, RFU1, RSTIN, AUX2UC, AUX1UC, I/OUC, CLKDIV1, CLKDIV2, CMDVCC and OFF voltage on card contact pins PRES, PRES, I/O, RST, AUX1, AUX2 and CLK voltage on pin VUP, S1 and S2 IC storage temperature continuous total power dissipation Rev. 04 — 20 February 2006 TDA8004T t de [1] Conditions Min 0.3 0.3 0 ...
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... Thermal characteristics Parameter thermal resistance from junction to ambient Conditions +85 C amb inactive mode active mode CLK XTAL Rev. 04 — 20 February 2006 TDA8004T IC card interface [1] Min Max - 150 Conditions Typ in free air 70 Min Typ Max ...
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... I < 200 mA < 400 ns from 20 kHz to 200 MHz CC from short-circuit to ground CC up down depending on specification of crystal or resonator used Rev. 04 — 20 February 2006 TDA8004T IC card interface Min Typ Max - - 0 150 2 ...
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... from IL(max) IH(min pF load (see Figure load Rev. 04 — 20 February 2006 TDA8004T IC card interface Min Typ Max - - 0. 0 0.75V - 300 1 0 ...
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... 200 250 load 200 200 < V < < V < Rev. 04 — 20 February 2006 TDA8004T IC card interface Min Typ Max 0.1 2 0.3 0. ...
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... A OH see Figure 5 see Figure 6 see Figure 5 see Figure 5 should be decoupled to CGND using two ceramic multilayer capacitors of low ESR with values of Figure 90% 90% 10% 10 Rev. 04 — 20 February 2006 TDA8004T Min Typ Max ) 0.4 0.75V - - DD - 135 - - - 110 - 180 220 60 ...
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... CLKDIV2, RSTIN, PRES, PRES, AUX1UC, AUX2UC, I/OUC, RFU1, CMDVCC and OFF should be referenced to V For optimum layout be sure that there is enough ground area around the TDA8004T and the connector. Place the TDA8004T very near to the connector, ideally under the connector, and decouple V Refer to “ ...
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... RST 13 16 CGND CLK 14 15 (5) CARD READ (normally closed type ( Rev. 04 — 20 February 2006 TDA8004T IC card interface +3.3 V POWERED MICROCONTROLLER 100 nF +3.3 V +3.3 V 100 (2) (5) nF (3) (5) mgm179 © Koninklijke Philips Electronics N.V. 2006. All rights reserved ...
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... 0.49 0.32 18.1 7.6 10.65 1.27 0.36 0.23 17.7 7.4 10.00 0.019 0.013 0.71 0.30 0.419 0.05 0.014 0.009 0.69 0.29 0.394 REFERENCES JEDEC JEITA MS-013 Rev. 04 — 20 February 2006 TDA8004T detail 1.1 1.1 1.4 0.25 0.25 0.4 1.0 0.043 0.043 0.055 0.01 0.01 0.016 0.039 EUROPEAN PROJECTION © ...
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... To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: TDA8004T_4 Product data sheet 2 called small/thin packages. Rev. 04 — 20 February 2006 TDA8004T IC card interface 3 350 mm so called © Koninklijke Philips Electronics N.V. 2006. All rights reserved ...
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... Suitability of surface mount IC packages for wave and reflow soldering methods [1] [3] , LBGA, LFBGA, SQFP, [3] , TFBGA, VFBGA, XSON , SO, SOJ [8] [9] [8] , PMFP , WQCCN..L Rev. 04 — 20 February 2006 TDA8004T IC card interface Soldering method Wave Reflow not suitable suitable [4] not suitable suitable suitable suitable [5][6] not recommended ...
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... The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. TDA8004T_4 Product data sheet 10 C measured in the atmosphere of the reflow oven. The package Rev. 04 — 20 February 2006 TDA8004T IC card interface © Koninklijke Philips Electronics N.V. 2006. All rights reserved ...
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... Product specification Product specification Preliminary specification Rev. 04 — 20 February 2006 TDA8004T IC card interface Change notice Supersedes - TDA8004T_3 (9397 750 13141) - TDA8004T_2 (9397 750 06034) - TDA8004_1 (9397 750 02928 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. ...
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... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Rev. 04 — 20 February 2006 TDA8004T IC card interface © Koninklijke Philips Electronics N.V. 2006. All rights reserved ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Koninklijke Philips Electronics N.V. 2006. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. TDA8004T IC card interface All rights reserved. Date of release: 20 February 2006 Document identifier: TDA8004T_4 ...