TDA1308AT NXP Semiconductors, TDA1308AT Datasheet
TDA1308AT
Available stocks
Related parts for TDA1308AT
TDA1308AT Summary of contents
Page 1
TDA1308; TDA1308A Class-AB stereo headphone driver Rev. 04 — 25 January 2007 1. General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in ...
Page 2
... PSRR T amb [ [ [ Ordering information Table 2. Type number Package TDA1308 TDA1308T TDA1308AT TDA1308AUK WLCSP8 TDA1308TT TDA1308_A_4 Product data sheet Quick reference data …continued = kHz amb i Parameter Conditions total power no load dissipation maximum output (THD + N)/S < ...
Page 3
... NXP Semiconductors 5. Block diagram Fig 1. Block diagram 6. Pinning information 6.1 Pinning TDA1308(A) 1 OUTA INA(neg) 2 INA(pos 001aaf782 Fig 2. Pin configuration TDA1308(A) 6.2 Pin description Table 3. Symbol OUTA INA(neg) INA(pos INB(pos) TDA1308_A_4 Product data sheet TDA1308( OUTA 2 INA(neg INA(pos) ...
Page 4
... NXP Semiconductors Table 3. Symbol INB(neg) OUTB V DD Table 4. Symbol OUTA V SS INA(pos) OUTB INA(neg) INB(neg INB(pos) 7. Internal circuitry I NA/B(pos) INA/B(neg) Fig 4. Equivalent schematic diagram TDA1308_A_4 Product data sheet Pin description TDA1308(A) …continued Pin Description 6 inverting input B 7 output B 8 positive supply ...
Page 5
... NXP Semiconductors 8. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter SC(O) T stg T amb V esd [1] Human body model (HBM 100 pF 1500 ; 3 pulses positive plus 3 pulses negative. [2] Machine model (MM 200 pF 0.5 mH pulses positive plus 3 pulses negative. ...
Page 6
... NXP Semiconductors 10. Characteristics Table 7. Characteristics amb Symbol Parameter Supplies V supply voltage DD V negative supply voltage SS I supply current DD P total power dissipation tot Static characteristics V input offset voltage I(os) I input bias current bias V common mode voltage ...
Page 7
... NXP Semiconductors Table 7. Characteristics …continued amb Symbol Parameter C input capacitance i SR slew rate B bandwidth [1] Values are proportional (THD + N)/S < 3.5 V (at 0 dB). DD O(p- 1.19 V (at 7.96 dBV); for TDA1308A only. DD O(p-p) 11. Application information ...
Page 8
... NXP Semiconductors 12. Test information Fig 6. Measurement circuit for inverting application (dB Fig 7. Open-loop gain as a function of input frequency TDA1308_A_4 Product data sheet V DD 3 INA 3 V ref (typ INB 3.9 k mka784 G (dB) ...
Page 9
... NXP Semiconductors 100 P o (mW Fig 9. Output power as a function of supply voltage Fig 11. Total harmonic distortion plus noise-to-signal ratio as a function of output voltage 12.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. TDA1308_A_4 Product data sheet ...
Page 10
... NXP Semiconductors 13. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
Page 11
... NXP Semiconductors SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
Page 12
... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
Page 13
... NXP Semiconductors WLCSP8: wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm bump A1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.10 0.39 0.123 mm 0.49 0.07 0.37 0.091 OUTLINE VERSION IEC TDA1308AUK Fig 15. Package outline TDA1308AUK (WLCSP8) TDA1308_A_4 Product data sheet ...
Page 14
... NXP Semiconductors 14. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
Page 15
... NXP Semiconductors 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
Page 16
... NXP Semiconductors Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . TDA1308_A_4 Product data sheet maximum peak temperature = MSL limit, damage level temperature minimum peak temperature ...
Page 17
... TDA1308_A_4 20070125 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors • Legal texts have been adapted to the new company name where appropriate • Type number TDA1308AUK has been added TDA1308_A_3 ...
Page 18
... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
Page 19
... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Internal circuitry Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 12.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 13 Package outline ...