TDA8552T/N1,518 NXP Semiconductors, TDA8552T/N1,518 Datasheet - Page 24

• Manufacturer Part Number: TDA8552T/N1,518
• Description: IC AMP AUDIO PWR 1.4W AB 20SOIC
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA8552T/N1,518

• Output Type: 2-Channel (Stereo)
• Package / Case: 20-SOIC (7.5mm Width)
• Max Output Power X Channels @ Load: 1.4W x 2 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 1.4 W
• Available Set Gain: 30 dB
• Thd Plus Noise: 0.1 %, 0.04 %
• Operating Supply Voltage: 5 V
• Maximum Power Dissipation: 2200 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 32 Ohms
• Input Signal Type: Single
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935261315518; TDA8552TD-T; TDA8552TD-T

NXP Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2002 Jan 04
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
24
not suitable
suitable
not recommended
not recommended
not suitable
WAVE
TDA8552T; TDA8552TS
(2)
SOLDERING METHOD
(3)(4)
(5)
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
(1)