TDA8948J/N1,112 NXP Semiconductors, TDA8948J/N1,112 Datasheet
TDA8948J/N1,112
Specifications of TDA8948J/N1,112
TDA8948J
TDA8948J
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TDA8948J/N1,112 Summary of contents
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TDA8948J 4-channel audio amplifier Rev. 01 — 27 February 2008 1. General description The TDA8948J contains four identical audio power amplifiers. The TDA8948J can be used as four Single-Ended (SE) channels with a fixed gain of 26 dB, two times ...
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... NXP Semiconductors 4. Quick reference data Table 1. SE circuit Figure BTL circuit Figure Symbol stb P o(SE) P o(BTL) THD G v SVRR [1] A minimum load is required at supply voltages of V [2] The amplifier can deliver output power with non-clipping output signals into nominal loads as long as the ratings of the IC are not exceeded ...
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... NXP Semiconductors [4] Supply voltage ripple rejection is measured at the output with a source impedance R input and with a frequency range from kHz (unweighted). The ripple voltage is a sine wave with a frequency f 5. Ordering information Table 2. Ordering information Type number Package Name TDA8948J DBS17P 6. Block diagram Fig 1 ...
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... NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. 7.2 Pin description Table 3. Symbol OUT1+ GND1 V CC1 OUT2 MODE2 IN2+ SGND IN1+ IN3+ MODE1 SVR IN4+ CIV OUT3 TDA8948J_1 Product data sheet OUT1 + 1 GND1 CC1 4 OUT2 MODE2 5 IN2 + 6 SGND 7 IN1 + 8 IN3 + 9 MODE1 10 SVR ...
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... NXP Semiconductors Table 3. Symbol GND2 V CC2 OUT4+ 8. Functional description 8.1 Input configuration The input cut-off frequency is cut off – For SE application cut off – For BTL application cut off – As shown in necessary, so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior. 8.2 Power amplifi ...
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... NXP Semiconductors 8.2.1 Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see The maximum output power is limited by the supply voltage (V maximum output current (I For supply voltages V • SE: R • BTL: R 8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion ...
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... NXP Semiconductors On - The amplifier is operating normally. The on mode is activated at V MODE1 The output channels 3 and 4 can be switched on/off by applying a proper DC voltage to pin MODE2, under the condition that the output channels 1 and 2 are in the on mode (see Figure 3). Table 5. Voltage on pin MODE1 ...
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... NXP Semiconductors 8.5 Built-in protection circuits The TDA8948J contains two types of detection sensors: one measures local temperatures of the power stages and one measures the global chip temperature local temperature of approximately 185 global temperature of approximately 150 C, this detection circuit switches off the power stages for 2 ms. High-impedance of the outputs is the result. After this time period the power stages switch on automatically and the detection will take place again ...
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... NXP Semiconductors 11. Static characteristics Table 8. Static characteristics amb L otherwise specified. Symbol Parameter Supply V supply voltage CC I quiescent current q I standby current stb Output pins V output voltage O V differential output voltage offset BTL mode O(offset) Mode selection pins V voltage on pin MODE1 ...
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... NXP Semiconductors Table 9. Dynamic characteristics amb L otherwise specified. Symbol Parameter V output noise voltage n(o) SVRR supply voltage ripple rejection V mute output voltage o(mute) channel separation cs G voltage gain difference v [1] The noise output voltage is measured at the output in a frequency range from kHz (unweighted), with a source impedance ...
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... NXP Semiconductors a. BTL; V Fig o(max) ( kHz i ( THD = THD = THD = THD = THD = SE: THD = 10 %; one channel Fig 5. Maximum output power as a function of supply voltage at various loads TDA8948J_1 Product data sheet mV output voltage as a function of voltage on pin MODE1 010aaa111 P o(max) (2) (3) (4) ( (V) P Rev. 01 — 27 February 2008 TDA8948J 4-channel audio amplifi ...
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... NXP Semiconductors 2 10 THD N (%) kHz Fig 6. Total harmonic distortion-plus-noise as a function of output power 10 THD N (%) Fig 7. Total harmonic distortion-plus-noise as a function of frequency TDA8948J_1 Product data sheet mce488 10 THD N (%) ( BTL mce489 10 THD N (%) (Hz) b. BTL Rev. 01 — 27 February 2008 TDA8948J 4-channel audio amplifier ...
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... NXP Semiconductors 20 P tot ( Fig 8. Total power dissipation as a function of channel output power per channel (worst case, all channels driven (dB 100 Fig 9. Channel separation as a function of frequency (no band-pass filter applied) TDA8948J_1 Product data sheet 010aaa430 Ptot ( (W) o mce495 (Hz) Rev. 01 — 27 February 2008 TDA8948J 4-channel audio amplifi ...
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... NXP Semiconductors 0 SVRR (dB SOURCE A band-pass filter kHz has been applied. Inputs short-circuited Fig 10. Supply voltage ripple rejection as a function of frequency TDA8948J_1 Product data sheet mce497 SVRR (dB (Hz) = 300 mV (RMS). ripple b. BTL Rev. 01 — 27 February 2008 TDA8948J 4-channel audio amplifi 300 mV (RMS). ...
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... NXP Semiconductors 13. Application information 13.1 Application diagrams VCC 100 k 270 BC547 7.5 V 2.2 F micro- BC547 controller 1.5 k Fig 11. Typical application diagram without on/off switching plops Table 11. Microcontroller with open-collector output; see Microcontroller LOW HIGH TDA8948J_1 Product data sheet 220 nF IN1 220 nF ...
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... NXP Semiconductors 220 220 470 MICRO- CONTROLLER VCC Fig 12. Application diagram with one pin control and reduction of capacitor Remark: Because of switching inductive loads, the output voltage can rise beyond the maximum supply voltage high supply voltages recommended to use (Schottky) diodes to the supply voltage and ground. ...
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... NXP Semiconductors 13.2 Printed-circuit board 13.2.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals ...
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... NXP Semiconductors 13.3 Thermal behavior and heat sink calculation The measured maximum thermal resistance of the IC package calculation for the heat sink can be made, with the following parameters: T amb(max and j(max the total thermal resistance between the junction and the ambient including the th(tot) heat sink ...
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... NXP Semiconductors 150 T j (˚C ) (1) (2) (3) 100 external heat sink of 4.3 K/W. amb ( ( ( ( ( times various SE loads with music signals. Fig 14. Junction temperature as a function of supply voltage for various loads with music signals 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. ...
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... NXP Semiconductors 15. Package outline DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm DIMENSIONS (mm are the original dimensions) UNIT 17.0 4.6 0.75 0.48 24.0 mm 15.5 4.4 0.60 0.38 23.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE ...
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... NXP Semiconductors 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . TDA8948J_1 Product data sheet maximum peak temperature = MSL limit, damage level temperature minimum peak temperature ...
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... NXP Semiconductors 17. Revision history Table 14. Revision history Document ID Release date TDA8948J_1 20080227 TDA8948J_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 27 February 2008 TDA8948J 4-channel audio amplifier Supersedes - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Functional features . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 5 8.1 Input configuration . . . . . . . . . . . . . . . . . . . . . . 5 8.2 Power amplifi ...