TFA9842AJ/N1,112 NXP Semiconductors, TFA9842AJ/N1,112 Datasheet - Page 15

• Manufacturer Part Number: TFA9842AJ/N1,112
• Description: IC AMP AUDIO PWR 7.5W STER 9SIL
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TFA9842AJ/N1,112

• Output Type: 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 7.5W x 2 @ 4 Ohm
• Voltage - Supply: 9 V ~ 28 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
• Mounting Type: Through Hole
• Package / Case: 9-SIL (Bent and Staggered Leads)
• Product: Class-AB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935278063112; TFA9842AJ/N1; TFA9842AJ/N1

Philips Semiconductors
16. Soldering
TFA9842AJ_1
Preliminary specification
16.1 Introduction to soldering through-hole mount packages
16.2 Soldering by dipping or by solder wave
16.3 Manual soldering
16.4 Package related soldering information
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Table 10.
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Rev. 01 — 28 April 2006
7.5 W stereo power amplifier with volume control
Soldering method
Dipping
-
suitable
-
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
TFA9842AJ
Wave
suitable
suitable
not suitable
stg(max)
[1]
). If the
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