ADA4937-1YCPZ-R7 Analog Devices Inc, ADA4937-1YCPZ-R7 Datasheet - Page 22

• Manufacturer Part Number: ADA4937-1YCPZ-R7
• Description: IC ADC DRIVER DIFF 16-LFCSP
• Manufacturer: Analog Devices Inc
• Type: ADC Driverr

Specifications of ADA4937-1YCPZ-R7

• Design Resources: Driving AD9233/46/54 ADCs in AC-Coupled Baseband Appls (CN0051)
• Applications: Data Acquisition
• Mounting Type: Surface Mount
• Package / Case: 16-LFCSP
• No. Of Amplifiers: 1
• Input Offset Voltage: 2.5mV
• Bandwidth: 1.9GHz
• Slew Rate: 6000V/µs
• Supply Voltage Range: 3V To 5.25V
• Supply Current: 39.5mA
• Amplifier Case Style: LFCSP
• No. Of Pins: 16
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADA4937-1YCPZ-R7TR

ADA4937-1/ADA4937-2
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4937-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design. This section shows a detailed example of how
the design issues of the ADA4937-1 were addressed.
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4937-1 as possible.
However, the area near the feedback resistors (R
resistors (R
should be cleared of all ground and power planes (see Figure 61).
Clearing the ground and power planes minimizes any stray capa-
citance at these nodes and prevents peaking of the response of
the amplifier at high frequencies.
The thermal resistance, θ
the exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD 51-7.
Figure 61. Ground and Power Plane Voiding in Vicinity of R
G
), and the input summing nodes (Pin 2 and Pin 3)
Figure 63. Cross-Section of 4-layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in mm)
JA
, is specified for the device, including
GROUND PLANE
BOTTOM METAL
POWER PLANE
TOP METAL
F
), input gain
F
and R
G
Rev. C | Page 22 of 28
VIA HOLE
PLATED
1.30
0.30
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. Use high frequency ceramic
chip capacitors. It is recommended that two parallel bypass capaci-
tors (1000 pF and 0.1 µF) be used for each supply with the 1000 pF
capacitor placed closer to the device; further away, provide low
frequency bypassing using 10 µF tantalum capacitors from each
supply to ground.
Signal routing should be short and direct to avoid parasitic
effects. Wherever complementary signals exist, provide a sym-
metrical layout to maximize balanced performance. When
routing differential signals over a long distance, keep PCB
traces close together and twist any differential wiring to mini-
mize loop area. Doing this reduces radiated energy and makes
the circuit less susceptible to interference.
Figure 62. Recommended PCB Thermal Attach Pad Dimensions (mm)
1.30
0.80
1.30
0.80