BGW200 NXP Semiconductors, BGW200 Datasheet

BGW200

Manufacturer Part Number

BGW200

Description

Manufacturer

NXP Semiconductors

Datasheet

1.BGW200.pdf (4 pages)

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BGW200 Low-power

WLAN SiP

Optimized for low-power mobile applications, this complete,

single-package 802.11b solution combines a baseband/MAC,

RF transceiver, and power ampliﬁer into an ultra-small

(150 mm

consumption in standby mode and supports coexistence with

Bluetooth

Key features

•

Applications

•

Advanced, single-package WLAN SiP optimized for mobile handheld

devices

“No Host Load” design delivers easy integration and longer battery life

Lowest power consumption in standby mode: < 2 mW (typ)

Ultra-small form factor

Co-exists with Bluetooth 1.1 and 1.2

Complete software drivers, utility, and diagnostic tools

Smartphones, cellular phones,VoIP wireless phones

PDAs, handheld computing devices,WLAN adapter cards (Secure Digital)

Portable audio/video devices, MP3 players

Other handhelds and electronic devices for wireless digital, audio, multi-

media, and telephony

–

No RF-critical design required

Low total cost of ownership

Low-proﬁle 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)

Only three external components for entire solution

Host processor sleeps while BGW200 processes beacons

BGW200 wakes the host processor only upon data packet arrival

) package. It delivers the industry’s lowest power

solutions.

Complete, single-package 802.11b

solution for mobile handheld devices

The BGW200 is a complete, low-power 802.11b Wireless LAN (WLAN)

System-in-a-Package (SiP) solution optimized for battery-powered hand-

held devices. It enables consumers to connect to the growing number of

WLAN networks in ofﬁces, homes, and public places. It also allows service

providers to increase their network reach and customer base, enabling

complementary data and voice services across cellular/PCS and WLAN

networks. Coexistence support for Bluetooth 1.1 and 1.2 enables seamless

integration with Philips Bluetooth solutions.

The SiP format, with its complete system functionality, delivers quicker

design cycles, lower risk, simpliﬁed manufacturing, and a reduced bill of

materials.The single-package format also simpliﬁes assembly and testing,

and reduces yield losses.The SiP delivers a complete, fully tested imple-

mentation of 802.11b functionality, so development teams can focus their

energy on innovative product design instead of solving complex issues

related to RF layout.

Ultra-small footprint, ultra-low power consumption

The BGW200 uses a single, 68-pin HVQFN-like package that measures

only 10 x 15 x 1.3 mm.The entire 802.11b solution requires only three

external components and uses less than 180 mm

The BGW200 incorporates several features that decreases power con-

sumption.There is an integrated ARM7 processor, 1.25 Mbytes of SRAM,

256 Kbytes of ROM, optimized host interfaces (SDIO/SPI), and integrated

power management hardware/software algorithms.The result is the lowest

standby power consumption in the industry (less than 2 mW).

Superior “No Host Load” Architecture

The BGW200 is designed to place no load on the host processor, so

mobile devices can integrate WLAN functionality without compromis-

ing application performance or battery life.The BGW200 only interfaces

S e m i c o n d u c t o r s

of circuit board area.

Related parts for BGW200

BGW200 Summary of contents

Page 1

... Superior “No Host Load” Architecture The BGW200 is designed to place no load on the host processor, so mobile devices can integrate WLAN functionality without compromis- ing application performance or battery life.The BGW200 only interfaces of circuit board area ...

Page 2

... Reference designs and eval kits Reference design software drivers support PocketPC™ and Linux™ operating systems. Drivers for Palm™ and Symbian™ are in develop- ment.The BGW200 is backed by a complete set of software utility and diagnostic tools, and is available in evaluation kits. Table 1 ...

Page 3

... Instruction Pre-fetch Unit JTAG Joint Test Action Group MAC Medium Access Control BGW200 functional block diagram �� ...

Page 4

... BGW200 Low-power 802.11b SiP with baseband/MAC and RF transceiver for mobile handhelds Philips Semiconductors Philips Semiconductors is a worldwide company with over 100 sales ofﬁces in more than 50 countries. For a complete up-to-date list of our sales of- ﬁ ...

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