TDA7402 STMicroelectronics, TDA7402 Datasheet - Page 67

• Manufacturer Part Number: TDA7402
• Description: IC PROCESSOR CAR SIGNAL 44-LQFP
• Manufacturer: STMicroelectronics
• Type: Car Signal Processorr

Specifications of TDA7402

• Applications: Automotive Systems
• Mounting Type: Surface Mount
• Package / Case: 44-LQFP
• Case: QFP
• Dc: 05+
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TDA7402
10
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
packages. ECOPACK
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 39. LQFP44 (10x10) mechanical data and package dimensions
Note: 1. The size of exposed pad is variable depending of lead-
DIM.
ccc
A1
A2
D1
D2
D3
E1
E2
E3
L1
K
A
D
E
b
c
e
L
frame design pad size. End user should verify “D2” and
“E2” dimensions for each device application.
11.80
11.80
MIN.
0.05
1.35
0.30
0.09
9.80
2.00
9.80
2.00
0.45
12.00
10.00
12.00
10.00
TYP.
mm
1.40
0.37
8.00
8.00
0.80
0.60
1.00
®
3.5˚(min.),7˚(max.)
packages are lead-free. The category of second Level Interconnect
MAX.
12.20 0.4646 0.4724 0.4803
10.20 0.3858 0.3937 0.4016
12.20 0.4646 0.4724 0.4803
10.20 0.3858 0.3937 0.4016
1.60
0.15 0.0020
1.45 0.0531 0.0551 0.0571
0.45 0.0118 0.0146 0.0177
0.20 0.0035
0.75 0.0177
0.10
0.0787
0.0787
MIN.
0.3150
0.3150
0.0315
0.0394
inch
TYP.
0.0630
0.0059
0.0079
0.0295
0.0039
MAX.
LQFP44 (10 x 10 x 1.40mm)
MECHANICAL DATA
Exposed Pad Down
OUTLINE AND
Package information
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®