BAT54CV NXP Semiconductors, BAT54CV Datasheet - Page 6

• Manufacturer Part Number: BAT54CV
• Description: Two planar Schottky barrier double diodes with common cathodes and an integrated guard ring for stress protection encapsulated in a SOT666 ultra small and flat lead Surface-Mounted Device (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Packing information
11. Soldering
BAT54CV
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
BAT54CV
Fig 5.
2
For further information and the availability of packing methods, see
1.7
1.075
Reflow soldering is the only recommended soldering method.
Reflow soldering footprint BAT54CV (SOT666)
Packing methods
0.538
All information provided in this document is subject to legal disclaimers.
0.55
(2×)
Package
SOT666
Rev. 3 — 15 November 2010
0.45
(4×)
(4×)
0.5
Description
4 mm pitch, 8 mm tape and reel
2.75
2.45
2.1
1.6
1.7
0.65
(2×)
(2×)
0.6
Two Schottky barrier double diodes
(6×)
0.4
0.325
0.25
(2×)
(4×)
Section
0.375
(2×)
(4×)
0.3
[1]
14.
Dimensions in mm
BAT54CV
© NXP B.V. 2010. All rights reserved.
Packing quantity
4000
-115
solder lands
placement area
solder paste
occupied area
sot666_fr
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