RB521S30 NXP Semiconductors, RB521S30 Datasheet

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra smalland flat lead Surface-Mounted Device (SMD) plastic package

RB521S30

Manufacturer Part Number
RB521S30
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra smalland flat lead Surface-Mounted Device (SMD) plastic package
Manufacturer
NXP Semiconductors
Datasheet

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1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small
and flat lead Surface-Mounted Device (SMD) plastic package.
I
I
I
I
I
I
I
I
I
I
Table 1.
T
[1]
[2]
Symbol
I
I
V
V
F(AV)
R
j
R
F
= 25 C unless otherwise specified.
RB521S30
200 mA low V
Rev. 01 — 6 October 2009
Average forward current: I
Reverse voltage: V
Low reverse current: I
AEC-Q101 qualified
Ultra small and flat lead SMD plastic package
Low current rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Reverse polarity protection
Low power consumption applications
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, mounting pad for
cathode 1 cm
Pulse test: t
Quick reference data
Parameter
average forward current
reverse current
reverse voltage
forward voltage
p
2
.
300 s;
F
R
MEGA Schottky barrier rectifier
R
0.02.
30 V
30 A
F(AV)
0.2 A
Conditions
square wave;
f = 20 kHz
T
T
V
I
F
amb
sp
R
= 0.5;
= 0.2 A
= 10 V
140 C
120 C
[1]
[2]
Min
-
-
-
-
-
Typ
-
-
2.5
-
420
Product data sheet
Max
0.2
0.2
30
30
500
Unit
A
A
V
mV
A

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RB521S30 Summary of contents

Page 1

... RB521S30 200 mA low V Rev. 01 — 6 October 2009 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small and flat lead Surface-Mounted Device (SMD) plastic package. ...

Page 2

... T average forward current square wave kHz T T non-repetitive peak t forward current half sine wave; JEDEC method total power dissipation T Rev. 01 — 6 October 2009 RB521S30 MEGA Schottky barrier rectifier F Simplified outline Graphic symbol [ Marking code ZB Min = 0.5; ...

Page 3

... standard footprint Rev. 01 — 6 October 2009 RB521S30 MEGA Schottky barrier rectifier F Min Max Unit - 150 C 55 +150 C ...

Page 4

... FR4 PCB, mounting pad for cathode 1 cm Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values RB521S30_1 Product data sheet 200 mA low Rev. 01 — 6 October 2009 RB521S30 MEGA Schottky barrier rectifier F 006aab710 (s) p 006aab711 ...

Page 5

... 100 200 mA F reverse current diode capacitance MHz; V 300 s; 0.02. p 006aab712 0.6 0.8 1.0 V (V) F Fig 4. Rev. 01 — 6 October 2009 RB521S30 200 mA low V MEGA Schottky barrier rectifier F Min Typ [1] - 130 - 190 - 255 - 355 - 420 - 2 ...

Page 6

... RB521S30_1 Product data sheet 006aab714 P F(AV) ( (V) R Fig 6. 006aab716 I F(AV) ( (V) R Fig 8. Rev. 01 — 6 October 2009 RB521S30 200 mA low V MEGA Schottky barrier rectifier F 0.15 (3) 0.10 (2) (1) 0.05 0.0 0.0 0.1 0 150 C j (1) = 0.1 (2) = 0.2 (3) = 0.5 ( Average forward power dissipation as a function of average forward current ...

Page 7

... Fig 10. Average forward current as a function SAMPLING OSCILLOSCOPE mga881 input signal = 0.6 ns; reverse voltage pulse duration t r Rev. 01 — 6 October 2009 RB521S30 MEGA Schottky barrier rectifier F 006aab719 (1) (2) (3) ( 100 125 150 150 ...

Page 8

... RB521S30_1 Product data sheet DC, and RMS M 0.85 0.75 1.65 1.25 1.55 1.15 0.34 0.26 Dimensions in mm Rev. 01 — 6 October 2009 RB521S30 200 mA low V MEGA Schottky barrier rectifi duty cycle = 006aaa812 Figure 8, 9 and with I defined as peak current ...

Page 9

... Packing methods SOD523 2 mm pitch tape and reel 4 mm pitch tape and reel 2.15 1.1 1 Reflow soldering is the only recommended soldering method. Rev. 01 — 6 October 2009 RB521S30 MEGA Schottky barrier rectifier F [1] Packing quantity 3000 8000 - -315 -115 - Section 14. ...

Page 10

... Revision history Table 9. Revision history Document ID Release date RB521S30_1 20091006 RB521S30_1 Product data sheet 200 mA low V Data sheet status Change notice Product data sheet - Rev. 01 — 6 October 2009 RB521S30 MEGA Schottky barrier rectifier F Supersedes - © NXP B.V. 2009. All rights reserved ...

Page 11

... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 01 — 6 October 2009 RB521S30 MEGA Schottky barrier rectifier F © NXP B.V. 2009. All rights reserved ...

Page 12

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com RB521S30 All rights reserved. Date of release: 6 October 2009 Document identifier: RB521S30_1 ...

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