PMEG2005BELD NXP Semiconductors, PMEG2005BELD Datasheet - Page 3
PMEG2005BELD
Manufacturer Part Number
PMEG2005BELD
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD882D Surface-Mounted Device (SMD) plastic package with visible and solderab
Manufacturer
NXP Semiconductors
Datasheet
1.PMEG2005BELD.pdf
(14 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PMEG2005BELD
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
5. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
6. Thermal characteristics
Table 6.
[1]
[2]
[3]
[4]
[5]
[6]
PMEG2005BELD
Preliminary data sheet
Symbol
V
I
I
I
I
P
T
T
T
Symbol
R
R
F
F(AV)
FRM
FSM
j
amb
stg
R
tot
th(j-a)
th(j-sp)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on a ceramic PCB, Al
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses P
significant part of the total power losses.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Device mounted on a ceramic PCB, Al
Soldering point of cathode tab.
Limiting values
Thermal characteristics
Parameter
reverse voltage
forward current
average forward current
repetitive peak forward current
non-repetitive peak forward
current
total power dissipation
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance
from junction to
ambient
thermal resistance
from junction to solder
point
2
2
O
O
3
3
, standard footprint.
Conditions
in free air
, standard footprint.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 January 2012
Conditions
T
T
square wave; δ = 0.5; f = 20 kHz;
T
square wave; δ = 0.5; f = 20 kHz;
T
t
square wave; t
T
p
j
sp
amb
sp
amb
≤ 1 ms; δ ≤ 0.25
= 25 °C
≤ 140 °C
≤ 140 °C
≤ 115 °C
≤ 25 °C
p
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
= 8 ms; T
j(init)
= 25 °C
[1][2][3]
[1][4][3]
[1][5][3]
[6]
PMEG2005BELD
2
.
[1]
[2][3]
[1][3]
[4][3]
Min
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
-55
-65
Typ
-
-
-
-
© NXP B.V. 2012. All rights reserved.
150
150
Max
20
0.5
0.5
0.5
3
6
370
735
1135
150
Max
340
170
110
25
R
2
.
are a
Unit
V
A
A
A
A
A
mW
mW
mW
°C
°C
°C
Unit
K/W
K/W
K/W
K/W
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