PMEG2010AEH_PMEG2010AET NXP Semiconductors, PMEG2010AEH_PMEG2010AET Datasheet
PMEG2010AEH_PMEG2010AET
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PMEG2010AEH_PMEG2010AET Summary of contents
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PMEG2010AEH; PMEG2010AET 1 A very low V Rev. 03 — 28 March 2007 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted ...
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... Type number PMEG2010AEH PMEG2010AET 4. Marking Table 5. Type number PMEG2010AEH PMEG2010AET [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V Pinning Description cathode anode anode not connected cathode Ordering information Package Name ...
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... Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [4] Soldering point of cathode tab. PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V Limiting values Parameter reverse voltage ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol [1] Pulse test: t PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V Characteristics Parameter Conditions forward voltage 100 reverse current ...
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... amb ( amb Fig 1. Forward current as a function of forward voltage; typical values MHz amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V mdb823 (3) (4) 0.3 0.4 0.5 ...
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... Fig 5. Package outline SOD123F 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG2010AEH PMEG2010AET [1] For further information and the availability of packing methods, see PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low 1.2 1.0 ...
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... NXP Semiconductors 11. Soldering Fig 7. Reflow soldering footprint SOD123F PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V 4.4 4 2.9 1.6 2.1 1.6 1 Reflow soldering is the only recommended soldering method. Dimensions in mm Rev. 03 — 28 March 2007 MEGA Schottky barrier rectifiers F solder lands solder resist 1 ...
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... NXP Semiconductors Fig 8. Reflow soldering footprint SOT23 (TO-236AB) 4.60 Fig 9. Wave soldering footprint SOT23 (TO-236AB) PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V 2.90 2.50 0.85 2 3.00 1.30 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 4.00 1.20 3 2.80 4.50 Rev. 03 — 28 March 2007 MEGA Schottky barrier rectifiers F 1 solder lands 2.70 solder resist ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID PMEG2010AEH_PMEG2010AET_3 20070328 Modifications: PMEG2010AEH_2 PMEG2010AEH_1 PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V Release date Data sheet status Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • ...
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... Contact information For additional information, please visit: For sales office addresses, send an email to: PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V [3] Defi ...
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... NXP B.V. 2007. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com MEGA Schottky barrier rectifiers F All rights reserved. Date of release: 28 March 2007 Document identifier: PMEG2010AEH_PMEG2010AET_3 ...